Shindengen MD1320N, Руководство по применению, Страница: 8 / 24

7
1 ) Mounting
Vibration and other mechanical disturbances
can exert stress on the internal parts of the
device. Carefully examine your equipment and
place the device where vibration and other
shock is minimal.
2 ) Soldering cautions
Infrared reflow method
This method provides very high temperature
soldering. The chart at the right shows the
recommended temperature profiles for the
Infrared reflow soldering method.
Soldering iron
When using a soldering iron, observe the
following.
Soldering iron temperature: Not to exceed
300
Soldering iron contact time: Not to exceed 5
seconds
3 ) Cleaning cautions
Carefully remove all flux. Allow time for the soldered areas to completely dry before using the device.
4 ) Secondary mold cautions
After installation of the device to a board, remolding using plastic may be required. During this process, stress on the
device will depend on the type of plastic used. The best plastic (that which causes the least stress on the device) has a
minimum contraction ratio and high flexibility. Hardening temperatures should not exceed the storage temperature.
Carefully check the plastic characteristics before use.
Static electricity can damage the device. The person and clothing of personnel working with the device
should be grounded to prevent the build-up of static electricity. It is recommended that personnel stand
on rubber mats (electrical safety mats) having a resistance greater than 1M when working with the
device. This will prevent damage to the device from static electricity discharge and protect the personnel
form electrical shock.
5
Mounting
0.5
9.53
1.4
0.8
(Figure 5-A)
5 - 1 Soldering pattern reference (Reflow-type)
5 - 2 Mounting cautions