R-350J
16
72
COM13
OUT
Common data signal : COM3.
Connected to LCD signal COM3.
73
COM14
OUT
Common data signal : COM2.
Connected to LCD signal COM2.
74
COM15
OUT
Common data signal : COM1.
Connected to LCD signal COM1.
75-102
SEG67-SEG40
OUT
Terminal not used.
103-142
SEG39-SEG0
OUT
Segment data signal.
Connected to LCD.
The relation between signals and LCD are as follows:
LSI signal
LCD
LSI signal
LCD
LSI signal
LCD
(Pin No.)
segment
(Pin No.)
segment
(Pin No.)
segment
SEG 39 (103) .......... SEG 1
SEG 25 (117) .......... SEG 15
SEG 12 (130) ........ SEG 28
SEG 38 (104) .......... SEG 2
SEG 24 (118) .......... SEG 16
SEG 11 (131) ........ SEG 29
SEG 37 (105) .......... SEG 3
SEG 23 (119) .......... SEG 17
SEG 10 (132) ........ SEG 30
SEG 36 (106) .......... SEG 4
SEG 22 (120) .......... SEG 18
SEG 9 (133) ........ SEG 31
SEG 35 (107) .......... SEG 5
SEG 21 (121) .......... SEG 19
SEG 8 (134) ........ SEG 32
SEG 34 (108) .......... SEG 6
SEG 20 (122) .......... SEG 20
SEG 7 (135) ........ SEG 33
SEG 33 (109) .......... SEG 7
SEG 19 (123) .......... SEG 21
SEG 6 (136) ........ SEG 34
SEG 32 (110) .......... SEG 8
SEG 18 (124) .......... SEG 22
SEG 5 (137) ........ SEG 35
SEG 31 (111) .......... SEG 9
SEG 17 (125) .......... SEG 23
SEG 4 (138) ........ SEG 36
SEG 30 (112) .......... SEG 10
SEG 16 (126) .......... SEG 24
SEG 3 (139) ........ SEG 37
SEG 29 (113) .......... SEG 11
SEG 15 (127) .......... SEG 25
SEG 2 (140) ........ SEG 38
SEG 28 (114) .......... SEG 12
SEG 14 (128) .......... SEG 26
SEG 1 (141) ........ SEG 39
SEG 27 (115) .......... SEG 13
SEG 13 (129) .......... SEG 27
SEG 0 (142) ........ SEG 40
SEG 26 (116) .......... SEG 14
143
COM7
OUT
Common data signal : COM9.
Connected to LCD signal COM9.
144
COM6
OUT
Common data signal : COM10.
Connected to LCD signal COM10.
Pin No.
Signal
I/O
Description
PRECAUTIONS FOR USING LEAD-FREE SOLDER
1. Employing lead-free solder
The "Main PWB" of this model employs lead-free solder. This is indicated by the "LF" symbol printed on the PWB
and in the service manual. The suffix letter indicates the alloy type of the solder.
Example:
Indicates lead-free solder of tin, silver and copper.
2. Using lead-free wire solder
When repairing a PWB with the "LF" symbol, only lead-free solder should be used. (Using normal tin/lead alloy solder
may result in cold soldered joints and damage to printed patterns.)
As the melting point of lead-free solder is approximately 40˚C higher than tin/lead alloy solder, it is recommend that
a dedicated bit is used, and that the iron temperature is adjusted accordingly.
3. Soldering
As the melting point of lead-free solder (Sn-Ag-Cu) is higher and has poorer wettability, (flow), to prevent damage
to the land of the PWB, extreme care should be taken not to leave the bit in contact with the PWB for an extended
period of time. Remove the bit as soon as a good flow is achieved. The high content of tin in lead free solder will cause
premature corrosion of the bit. To reduce wear on the bit, reduce the temperature or turn off the iron when it is not
required.
Leaving different types of solder on the bit will cause contamination of the different alloys, which will alter their
characteristics, making good soldering more difficult. It will be necessary to clean and replace bits more often when
using lead-free solder. To reduce bit wear, care should be taken to clean the bit thoroughly after each use.
Sn-Ag-Cu
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