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3.5
CONTROLLING THE ACTIVATION PULSE WIDTH FOR THERMAL HEAD............... 3-23
3.5.1
Calculation of Activation Pulse Width........................................................................ 3-23
3.5.2 Calculation
of
Printing Energy ................................................................................... 3-23
3.5.3
Adjustment of Thermal Head Resistance.................................................................. 3-24
3.5.4
Adjustment of Thermal Head Drive Voltage .............................................................. 3-24
3.5.5
Setting of Activation Pause Time .............................................................................. 3-24
3.5.6
Adjustment by Thermal Head Activation Pulse Period .......................................... 3-24
3.5.7
Calculation Sample for the Activation Pulse Width ................................................. 3-25
3.5.8 Temperature
Characteristics of Thermistor ............................................................. 3-27
3.5.9
Detecting Abnormal Temperature of the Thermal Head ......................................... 3-29
3.6 OUT-OF-PAPER SENSOR ............................................................................................ 3-30
3.7 PLATEN
POSITION SENSOR ....................................................................................... 3-31
3.7.1 General
Specifications............................................................................................... 3-31
3.7.2
Platen Position Sensor Precautions .......................................................................... 3-31
CHAPTER 4
CONNECTING TERMINALS
4.1 RECOMMENDED
CONNECTOR
FOR EXTERNAL CIRCUITS ..................................... 4-1
4.2 CONNECTING
TERMINALS............................................................................................ 4-1
CHAPTER 5
PRINT DRIVE METHOD
5.1
MOTOR AND THERMAL HEAD DRIVE METHOD.......................................................... 5-1
5.2
THERMAL HEAD DIVISION DRIVE METHOD................................................................ 5-4
5.3 PRECAUTIONS
FOR PRINT DRIVE ............................................................................. 5-5
CHAPTER 6
OUTER CASE DESIGN GUIDE
6.1
SECURING THE PRINTER MAIN BODY ........................................................................ 6-1
6.1.1
How to Mount the Printer Main Body........................................................................... 6-1
6.1.2 Recommended
Screws ............................................................................................... 6-3
6.1.3
Precautions for Securing the Printer Main Body ......................................................... 6-3
6.2
CONNECT THE PRINTER TO FRAME GROUND (FG) ................................................. 6-4
6.2.1
How to Connect the Printer to Frame Groung (FG) .................................................... 6-4
6.3
DESIGN THE PLATEN RELEASE LEVER ...................................................................... 6-5
6.4
LAYOUT OF THE PRINTER AND THERMAL PAPER .................................................... 6-6
6.5
WHERE TO MOUNT THE PAPER HOLDER .................................................................. 6-7
6.6 DESIGN
PAPER EXIT...................................................................................................... 6-9