Seagate SkyHawk Product Manual, Rev. B
21
Drive Specifications
2.13.2 China Requirements — China RoHS 2
China RoHS 2 refers to the Ministry of Industry and Information Technology Order No. 32, effective July 1, 2016, titled
Management Methods for the Restriction of the Use of Hazardous Substances in Electrical and Electronic Products. To
comply with China RoHS 2, we determined this product's Environmental Protection Use Period (EPUP) to be 20 years in
accordance with the
Marking for the Restricted Use of Hazardous Substances in Electronic and Electrical Products,
SJT 11364-
2014.
ѝഭ⭥ಘ⭥ᆀӗ૱ᴹᇣ⢙䍘䲀ࡦ֯⭘㇑⨶࣎⌅
(Management Methods for the Restriction of the Use of Hazardous Substances in Electrical and
Electronic Products _ China RoHS)
ӗ૱ѝᴹᇣ⢙䍘Ⲵ〠৺ਜ਼䟿
(Name and Content of the Hazardous Substances in Product)
2.16 Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to light industrial
environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM B845. However, this
accelerated testing cannot duplicate every potential application environment. Users should use caution exposing any
electronic components to uncontrolled chemical pollutants and corrosive chemicals as electronic drive component
reliability can be affected by the installation environment. The silver, copper, nickel and gold films used in Seagate
products are especially sensitive to the presence of sulfide, chloride, and nitrate contaminants. Sulfur is found to be the
most damaging. In addition, electronic components should never be exposed to condensing water on the surface of the
printed circuit board assembly (PCBA) or exposed to an ambient relative humidity greater than 95%. Materials used in
cabinet fabrication, such as vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated.
The useful life of any electronic equipment may be extended by replacing materials near circuitry with sulfide-free
alternatives.
Table 9 Hazardous Substances
㒊௳ྡ⛠
Part Name
᭷ᐖ≀
䍘
Hazardous Substances
䫵
Lead
(Pb)
ợ
Mercury
(Hg)
䭹
Cadmium
(Cd)
භ௴
䬜
Hexavalent Chromium
(CF (VI))
ከ⁏
㚄
Ɽ
Polybrominated
biphenyls (PBB)
ከ⁏Ɽ
慂
Polybrominated
diphenyl ethers (PBDE)
༳ๅ
䓝嶗㜧乬
PCBA
X
O
O
O
O
O
ᮘ
Chassis
X
O
O
O
O
O
ᵜ㺘Ṭᦞ
SJ/T 11364
Ⲵ㿴ᇊ㕆ࡦDŽ
This table is prepared in accordance with the provisions of SJ/T 11364-2014
O
˖㺘⽪䈕ᴹᇣ⢙䍘൘䈕䜘Ԧᡰᴹ൷䍘ᶀᯉѝⲴਜ਼䟿൷൘
GB/T 26572
㿴ᇊⲴ䲀䟿㾱≲ԕлDŽ
O:
Indicates that the hazardous substance contained in all of the homogeneous materials for this part is below the limit
requirement
of
GB/T26572.
X
˖㺘⽪䈕ᴹᇣ⢙䍘㠣ቁ൘䈕䜘ԦⲴḀа൷䍘ᶀᯉѝⲴਜ਼䟿䎵ࠪ
GB/T 26572
㿴ᇊⲴ䲀䟿㾱≲DŽ
X:
Indicates that the hazardous substance contained in at least one of the homogeneous materials used for this part is above the
limit requirement of GB/T26572.
20
