Section 5. Maintenance
This section contains the following maintenance information:
• Observing maintenance precautions
• Arranging for depot repair
• Removing and replacing a drive
• Removing and replacing a power supply
• Packing a drive for shipment
Observing maintenance precautions
Because the drive is depot repairable, there are no field-replaceable parts.
Before beginning any maintenance activities, observe the following precau-
tions:
• Follow the precautions listed under “Electrostatic discharge protection” in the
preface.
• Do not remove any circuit boards from the drive chassis. Return the entire
drive for depot repair if any circuit board is defective. Removal of circuit boards
by personnel not performing depot repair will damage components and may
void the warranty.
• Do not remove the head and disc assembly (HDA) from the drive chassis.
Return the entire drive for depot repair if the HDA is defective.
• Do not attempt to disassemble the HDA. It is not field repairable. If the sealed
HDA is opened by personnel not performing depot repair, this will damage
components and void the warranty.
• Use forced-air ventilation when bench-testing the drive to ensure proper
cooling of drive components.
• Do not handle the drive while powered up, due to the gyroscopic motion
produced by discs that have not completed spinning down.
• Do not connect or disconnect the I/O cable while power is applied to the drive
or other SCSI devices. If the SCSI bus is active, this will cause errors.
• Do not connect or disconnect the DC power cable while the power supply is
energized.
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