SAMSUNG Proprietary-Contents may change without notice
2-2
SGH-A408 Electrical Parts List
Level
SEC CODE
REFERENCE
DESCRIPTIONS
Remark
1
2203-005509
C212
C-CERAMIC, CHIP 330 nF, +80-20 %, 10 V, Y5 V, TP,
1
2203-005061
C213
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1
2203-005061
C214
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1
2203-005061
C280
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1
2203-000233
C300
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1
2203-000233
C301
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1
2203-005053
C302
C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP,
1
2203-005053
C303
C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP,
1
2203-005446
C304
C-CERAMIC, CHIP 0.0027 nF, 0.1pF, 50 V, NP0, TP,
1
2404-001234
C305
C-TA, CHIP 68 uF, 20 %, 6.3 V, -, TP, 3.3x2.7x1.7mm
1
2203-005061
C306
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1
2203-000438
C308
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, -
1
2203-005053
C309
C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP,
1
2203-000628
C310
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1
2203-000628
C311
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1
2301-001230
C312
C-FILM, CHIP 10 nF, 5 %, 16 V, TP, 2012, -
1
2404-001105
C313
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1
2203-000940
C314
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, -
1
2203-000812
C315
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1
2203-000254
C316
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1
2203-000254
C317
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1
2203-000836
C318
C-CERAMIC, CHIP 390 pF, 10 %, 50 V, X7R, TP, -
1
2203-005664
C319
C-CERAMIC, CHIP 4700 nF, 10 %, 6.3 V, X5R, TP, 2012
1
2203-000812
C320
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1
2203-000438
C321
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, -
1
2203-000278
C322
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1
2203-005446
C323
C-CERAMIC, CHIP 0.0027 nF, 0.1pF, 50 V, NP0, TP,
1
2203-000278
C324
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1
2203-000254
C325
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1
2203-000425
C326
C-CERAMIC, CHIP 0.018 nF, 5 %, 50 V, NP0, TP,
1
2203-000425
C327
C-CERAMIC, CHIP 0.018 nF, 5 %, 50 V, NP0, TP,
1
2203-005065
C328
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1
2203-000940
C329
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, -
1
2203-000330
C330
C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP,
1
2203-000836
C331
C-CERAMIC, CHIP 390 pF, 10 %, 50 V, X7R, TP, -
1
2203-005481
C332
C-CERAMIC, CHIP 47 nF, 10 %, 10 V, X7R, TP, -
1
2203-005664
C333
C-CERAMIC, CHIP 4700 nF, 10 %, 6.3 V, X5R, TP, 2012
Содержание SGH-A408
Страница 20: ...SAMSUNG Proprietary Contents may change without notice 3 1 3 SGH A408 Block Diagrams 3 1 Main Block Diagram ...
Страница 21: ...SAMSUNG Proprietary Contents may change without notice 3 2 SGH A408 Block Diagrams 3 2 Main RF Block Diagram ...
Страница 56: ... Samsung Electronics Co Ltd November 2001 Pinted in Korea Code No GH68 02384A BASIC ELECTRONICS ...