Circuit Operation Description
5-40
Samsung Electronics
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Terminology
1. 42” SD S2.0 Logic Main Board
1-1 Main Board
Applies video signals to the PDP by signaling to the X and Y drive boards and the logic E, F,
and G buffers.
2. 5V, 3.3V
2-1 5V : Voltage that passes through the logic main board and is applied to the logic buffer.
2-2 3.3V : Main power that is supplied to the logic main board.
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Preparations for Inspection
1. Testing the device/instrument: Measurement instruments should be used to finish calibration.
1-1 Inspection Table: Should supply both 110V and 220V power. It should have sufficient space to accom
modate all measurement instruments and samples.
1-2 Oscilloscope: Should have more than 2 channels. The frequency should be 500MHz.
1-3 Power Supply: One linear power supply that has the capacity for more than 5V/3A should be
prepared for supplying the main power. It should have a current limit function so that it can prevent
over current due to abnormal operation of the samples.
1-4 Logic Main Board: Perform testing on an inspection target board with TEST PROM.
2. Additionally, prepare needed measuring tools such as Vernier calipers and a multimeter.
♦
Preparations for Inspection
1. Inspection Method & Procedure and Acceptance Determination
2. Sample Status: The package of samples should arrive covered when delivered directly from the
manufacturer.
3. Inspection Items: On the Inspection Record Sheet record the measurement results of the waveforms
specified on Attachment 1 : TEST POINT.
4. Inspection Procedure
4-1 Inspect the width and length of the logic buffer board by using Vernier calipers, which have been
calibrated. Determine compliance to the specifications by referring to the numbers and drawings
below. Record the inspection result on the Inspection Record Sheet.
4-2 Inspect the type, location and installation orientation of the connectors and record the results on the
Inspection Record Sheet.
4-3 Visually inspect the soldering state of the ASS’Y Y. First, inspect the omitted part slots on the mounting
surface and the short-circuits on the various ICS and connector pins, and then inspect the
short-circuits on th opposite side. When the visual inspection is finished, record the inspection
results on the Inspection Record Sheet.
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