
Operating Instructions & Technical Document
Samsung Electronics
20
27/19
21/10
27.3
25.5
6.8
6.9
27/19
27/19
27.1
25.1
6.6
6.8
27/19
35/24
32.2
31.3
8.6
8.8
27/19
45/26
39.5
38.0
9.3
9.6
High Pressure
Low Pressure
A-unit
B-unit
A-unit
B-unit
Indoor
(DB/WB)
Cooing
Outdoor
(DB)
2-2-4 MH26AP1(P2)
■
Cooling(7.5m–Piping)
High Pressure (kgf/cm
2
G)
43.0
39.0
35.0
31.0
27.0
23.0
19.0
15.0
27.3
27.1
32.2
31.3
39.5
38.0
20
25
30
Outdoor Temperature (
ß
C)
35
40
45
A-unit
B-unit
25.46
25.46
25.06
25.06
25.5
25.1
Low Pressure (kgf/cm
2
G)
10.0
9.5
9.0
8.5
8.0
7.5
7.0
6.5
6.0
20
25
30
35
40
45
6.9
6.8
8.8
8.6
9.6
A-unit
B-unit
9.31
9.31
9.3
6.64
6.64
6.6
6.77
6.77
6.8
Outdoor Temperature (
ß
C)
DB98_16045A(4)_1 1/29/04 4:56 PM Page 20
Содержание MH18AP1(P2)-09
Страница 4: ...MEMO 3 Samsung Electronics ...
Страница 63: ...Samsung Electronics 62 8 PCB Diagram 8 1 MAIN PCB Indoor Unit TOP ...
Страница 64: ...63 Samsung Electronics PCB Diagram BOTTOM ...
Страница 67: ...Samsung Electronics 66 18K 19K 24K 8 2 MAIN PCB Outdoor Unit ...
Страница 68: ...PCB Diagram 67 Samsung Electronics 26K ...
Страница 73: ...MEMO Samsung Electronics 72 ...
Страница 77: ...MEMO Samsung Electronics 76 ...
Страница 81: ...MEMO Samsung Electronics 80 ...