Material Desc
Location
Qty UN
2703-002996 INDUCTOR-SMD;3.9uH,20%,10x10mm
L3
1 PC
2703-002996 INDUCTOR-SMD;3.9uH,20%,10x10mm
L4
1 PC
2703-002996 INDUCTOR-SMD;3.9uH,20%,10x10mm
L6
1 PC
2801-004203 CRYSTAL-SMD;25MHz,30ppm,-,15.0pF,50ohm,T
Y1
1 PC
2801-004517 CRYSTAL-SMD;25.0MHz,30ppm,-,10pF,50ohm,T
Y2
1 PC
2801-004547 CRYSTAL-SMD;25.0000MHz,50ppm,HCX-5FA,10p
Y2
1 PC
3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
B1
1 PC
3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
B10
1 PC
3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
B6
1 PC
3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
B7
1 PC
3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
B8
1 PC
3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
B9
1 PC
3301-000326 BEAD-SMD;60ohm,3225,-,43ohm/40MHz,83ohm/
B4
1 PC
3301-001148 BEAD-SMD;60ohm,1608,TP,-,-
B2
1 PC
3301-001148 BEAD-SMD;60ohm,1608,TP,-,-
B3
1 PC
3301-001772 BEAD-SMD;27ohm,1608,-,TP,30ohm/120MHz,48
B5
1 PC
3701-001326 CONNECTOR-DSUB;15P,2R,FEMALE,ANGLE,NI
J4
1 PC
3704-001153 SOCKET-IC;479P,PGA,AU,1.27mm
J5
1 PC
3709-001341 CONNECTOR-CARD EDGE;200P,0.6mm,SMD-A,AUF
DDR2
1 PC
3709-001401 CONNECTOR-CARD EDGE;52P,0.8mm,SMD-A,AU,m
J650
1 PC
3709-001413 CONNECTOR-CARD EDGE;44P,0.8mm,SMD-A,AU,4
J7
1 PC
3709-001459 CONNECTOR-CARD EDGE;200P,0.6mm,SMD-A,Au,
DDR1
1 PC
3710-002114 CONNECTOR-SOCKET;50P,2R,0.8mm,ANGLE,AU,B
J612
1 PC
3710-002133 SOCKET-BOARD TO BOARD;12P,2R,0.8mm,SMD-A
J627
1 PC
3711-000386 HEADER-BOARD TO CABLE;BOX,10P,1R,1.25MM,
J8
1 PC
3711-000541 HEADER-BOARD TO CABLE;BOX,2P,1R,1.25mm,S
J11
1 PC
3711-000541 HEADER-BOARD TO CABLE;BOX,2P,1R,1.25mm,S
J3
1 PC
3711-000541 HEADER-BOARD TO CABLE;BOX,2P,1R,1.25mm,S
J6
1 PC
3711-006364 CONNECTOR-HEADER;BOX,22P,1R,1.27mm,SMD-A
J637
1 PC
3711-006376 HEADER-BATTERY;NOWALL,5P,1R,2.50mm,BATTE
J2
1 PC
3722-001692 JACK-MODULAR;12P/10C,STANDARD,N,SMD-OFFS
J638
1 PC
3722-002002 JACK-USB;4P/1C,TIN,BLK,ANGLE-OFFSET,-
J1
1 PC
3722-002191 JACK-DC POWER;3P,5.6pi,Sn-P,Black
J622
1 PC
3722-002382 JACK-USB;4P/2C,AUF,BLK,ANGLE-OFFSET,A TY
J631
1 PC
3722-002544 JACK-PHONE;6P,AU,LIME,ANGLE
J9
1 PC
3722-002545 JACK-PHONE;6P,AU,PINK,ANGLE
J10
1 PC
BA41-00726A PCB;Hainan2,FR-4, High Tg,6L,1.0,T1.2,26
PCB(GCE)
1 PC
BA41-00732A PCB;Hainan2,FR-4, High Tg,6L,1.0,T1.2,26
PCB(NANYA)
1 PC
BA46-05535A BIOS;HAINAN2,-,SYSTEM,KOR,00SH,-,SPI BIO
BIOS
1 PC
BA46-05536A S/W MICOM;HAINAN2,-,SYSTEM,KOR,00SH,-,S/
MICOM
1 PC
BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5
M1
1 PC
BA61-00784A SUPPORT-VIDEO_BD;ARGO,CU ALLOY,T3.5,W3.5
M2
1 PC
Содержание Hainan-C
Страница 61: ...5 24 This Document can not be used without Samsung s authorization 5 Troubleshooting ...
Страница 62: ...5 25 This Document can not be used without Samsung s authorization 5 Troubleshooting ...
Страница 66: ...8 2 8 System Block Diagram 8 2 Power Diagram This Document can not be used without Samsung s authorization ...
Страница 67: ...8 3 8 System Block Diagram 8 3 Power Sequence This Document can not be used without Samsung s authorization ...
Страница 70: ...8 6 8 System Block Diagram 8 6 Board Information This Document can not be used without Samsung s authorization ...
Страница 107: ...11 2 11 References This Document can not be used without Samsung s authorization ...
Страница 123: ...11 18 11 References This Document can not be used without Samsung s authorization ...