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Circuit Operating Descriptions
13-8
Samsung Electronics
13-5 Domino (DMN-8602)
SPARC Processor Core
I-Cache
64
4-
Port
4-
Port
S/PDIF
16/32
32
1x8/1x10 YUV
1x8
YUV
Data
Memory/
Cache
Host
and
Graphics
Audio DSP
and
Memory
Video
Interface
Audio
Interface
Host
Interface
Bitstream/
Storage
Interface
USB
Interface
1394
Link
Interface
Serial I/O
DENC
SPARC Processor Core
I-Cache
Data
Memory/
Cache
Host
and
Graphics
SDRAM
SGRAM
Array
Audio DSP
and
Memory
Video DSP
and
Memory
Motion
Estimator
and Memory
Memory
Controller
2Port
Fig. 13-7
1) SPARC Processors
Two 32-bit SPARC processors, one dedicated to video processing and the other assigned general system tasks
and audio processing, performthree classes of functions: system processing, audio processing, and high-level
control flow and decision-making tasks for video processing.
Optionally, they can also perform 2D graphics and host functions.
The SPARC processors have a programmable, scalable architecture that includes an internal 16 Kbyte
instruction cache and an internal configurable 16 Kbyte data memory/cache. Data memory is used instead
of a data cache when the software needs predictable real-time performance and overlapped DMA transfers.
Each SPARC delivers 150 MIPS of processing power.
The DMN-8602 device integrates a 2D graphics accelerator on the dual SPARC processors.
This graphics accelerator supports:
◆
On-Screen Display (OSD)
◆
2D graphical user interfaces
◆
A 32-bit RGBA with an 8-bit alpha blending channel, flicker filters, and a high-quality video scaler.
The DMN-8602 also supports multiple video inputs, windowed video and graphics with arbitrarily
relocatable and resizable windows, PiP (Picturein-Picture), letterbox, and side-by-side display of SD sources.
2) Memory Mapping
The following paragraphs and figures summarize the DMN-8602 memory map for different configurations.
These configurations include SDRAM access and access to internal registers via the internal Control Bus
(CBus).
Содержание BD-P1000
Страница 10: ...Precautions 1 6 Samsung Electronics MEMO ...
Страница 14: ...Product Specification 2 4 Samsung Electronics MEMO ...
Страница 21: ...Disassembly and Reaasembly Samsung Electronics 4 7 4 2 PCB Location MAIN PCB SMPS PCB Fig 4 7 PCB Location ...
Страница 22: ...4 8 Samsung Electronics Disassembly and Reaasembly MEMO ...
Страница 23: ...Samsung Electronics 6 1 6 Exploded View and Parts List 6 1 Cabinet Assembly 6 2 ...
Страница 26: ...Exploded Views and Parts List 6 4 Samsung Electronics MEMO ...