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Samsung Semiconductor, Inc.
ARTIK 530s Development Kit
6
ARTIK 530
S
D
EVELOPMENT
K
IT
I
NTERPOSER
B
OARD
The ARTIK 530s Interposer Board interfaces are shown in
Figure 3
.
Figure 3. ARTIK 530s Interposer Board (Left - Top Side, Right - Bottom Side)
The ARTIK 530s Development Platform contains the ARTIK 530s module that is soldered to the Interposer board.
Table 1
shows the main features of the ARTIK 530s module. For more information on the ARTIK 530s module please
consult the ARTIK 530s module datasheet.
Table 1. ARTIK 530s Module Main Features
Feature
Description
CPU
Quad-core ARM Cortex A9 @ 1.2 GHz
GPU
3D graphics accelerator
Camera Interface
4-lane MIPI CSI up to 5M
(1920 x 1080 @ 30 fps)
Display interface
4-lane MIPI DSI and HDMI 1.4a (1920 x 1080p @ 60 fps), or
LVDS (1280 x 720p @ 60 fps)
Audio
Two I2S audio channels (input/output)
DRAM
512 MB DDR3
Flash
4 GB eMMC 4.5
Secure Element
Secure point to point authentication and data transfer
Trustware
Trusted execution environment
WLAN
IEEE 802.11a/b/g/n, dual-band SISO
Bluetooth
4.2 (BLE + Classic)
802.15.
Zigbee/Thread
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