Proc Sheet 2 05
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1/2
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- Tweezers.
- Soldering iron.
- Metal dome positioning fixture PN
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1. Remove the battery (
Proc Sheet 0 01
).
2. Remove mobile lower housing (
Proc Sheet 1 01
).
3. Remove equipped electronic board (
Proc Sheet 1 18
).
4. Remove the keypad (
Proc Sheet 1 04
).
5. Remove mobile upper housing (
Proc Sheet 1 13
).
6. Remove FLAP upper housing (
Proc Sheet 1 32
).
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1. Disolder the two in one receiver ( 1 ).
2. Remove the two in one receiver ( 2 ) from the FLAP lower housing use level control with tweezers.
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1. Solder a two in one receiver ( 1 ) and position the string of the two in one receiver in area ( 3 ).
2. Position the two in one receiver in its area ( 4 ).
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1. Place FLAP upper housing (
Proc Sheet 1 32
)
2. Place mobile upper housing (
Proc Sheet 1 13
).
3. Place the keypad (
Proc Sheet 1 04
).
4. Place equipped electronic board (
Proc Sheet 1 18
).
5. Place mobile lower housing (
Proc Sheet 1 01
).
6. Place the battery (
Proc Sheet 0 01
).
Risk of the procedure :
•
Stripe the lower and upper FLAP housing.
Procedure
Symptom
Test
REF MTB DTS 1- Indice A - December 16 2005
Page 5-31