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FEDL22594-06
ML22594-XXX
71/73
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact a ROHM sales office for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
Notes for heat sink type Package
This LSI adopts a heat sink type package to raise a radiation of heat characteristic. Be sure to design the land
pattern corresponding to the heat sink area of the LSI on a board, and solder each other. The heat sink area of the
LSI solder open or GND on the board.