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Application Note
BD71837MWV Platform Design Guide
© 2018 ROHM Co., Ltd.
No. 61AN002E Rev.001
May.2018
4.3. General Stack-up Recommendations
Type-3 and 6 layers
PCB technology are used for BD71837MWV ROHM’s EVM.
The following general stack-up is strongly recommended to be applied to all the routings on the PCB.
Surface plane layers are recommended to apply 1.9 Mils thick copper.
Internal plane layers are recommended to apply 1.2 Mils thick copper.
It is recommended I2C signals to have the reference versus solid planes over the length of their routing and not to
cross plane splits. Ground should be the ideal reference.
The extra area in each layers should be filled with as much ground or other power rails as possible.
There should not be any large free areas with no metal for each layer because of the improvement for heat
dissipation. Large metal area also reduces stray resistance and inductance.
4.4. 6-layer Board Stack-up
BD71837MWV ROHM’s EVM uses Type 3 PCB technology and Figure 4.3 shows the 6-layer PCB stack-up.
Figure 4.3 6-layers PCB stack-up
