Retsch AS 400 control, Руководство пользователя

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Cleaning, Wear and Maintenance
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11 Cleaning, Wear and Maintenance
11.1 Cleaning
WARNING
W6.0003
Risk to life caused by an electric shock
Cleaning live parts with water
−
Cleaning the device with water can lead to life-threatening injuries caused
by an electric shock if the device has not been disconnected from the
power supply.
•
Only carry out cleaning work on the device when it has been
disconnected from the power supply.
•
Use a cloth moistened with water for cleaning.
•
Do not clean the device under running water!
NOTICE
N14.0009
Damage to the housing and device
Use of organic solvents
−
Organic solvents may damage plastic parts and the coating.
•
The use of organic solvents is not permitted.

Clean the housing of the device with a damp cloth and if necessary, with a household
cleaning agent. Pay attention that no water or cleaning agent enters the interior of the
device.
11.1.1 Cleaning of Test Sieves
Test sieves are measuring instruments and should be treated with due care before, during and
after the sieving process. It is recommended to clean new test sieves before the first use from
possible preservative residues with ethanol or isopropanol and to store them in a dry, dust-free
place when unused.
Before cleaning or drying the test sieves, the O-rings have to be removed. Before using and
after the cleaning the test sieves should be visibly inspected for possible damages and
impurities.
Near-mesh or clamped particles can be often removed dry after the sieving process by slightly
tapping the test sieve upside down with the sieve frame on a table. For test sieves with mesh
sizes > 500 µm a fine hair brush can be used to sweep over the outer side of the mesh fabric.
11.1.1.1 Cleaning of Test Sieves with Mesh Sizes > 500 µm
Coarse mesh fabrics with mesh sizes > 500 µm can be cleaned dry or wet easily and effectively
with a hand brush with plastic bristles (at not too high applied pressure).
11.1.1.2 Cleaning of Test Sieves with Mesh Sizes < 500 µm
Test sieves with mesh sizes < 500 µm should generally only be cleaned in an ultrasonic
cleaning-bath. As cleaning agent, water together with a standard surfactant is recommended.
The cleaning in the ultrasonic bath usually takes two to three minutes. After that the test sieves