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Cautions 

Keep safety first in your circuit designs! 
1.  Renesas Technology Corp. puts the maximum effort into making semiconductor products 

better and more reliable, but there is always the possibility that trouble may occur with them. 
Trouble with semiconductors may lead to personal injury, fire or property damage. 
Remember to give due consideration to safety when making your circuit designs, with 
appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of 
nonflammable material or (iii) prevention against any malfunction or mishap. 

 
Notes regarding these materials 
1.  These materials are intended as a reference to assist our customers in the selection of the 

Renesas Technology Corp. product best suited to the customer's application; they do not 
convey any license under any intellectual property rights, or any other rights, belonging to 
Renesas Technology Corp. or a third party. 

2.  Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any 

third-party's rights, originating in the use of any product data, diagrams, charts, programs, 
algorithms, or circuit application examples contained in these materials. 

3.  All information contained in these materials, including product data, diagrams, charts, 

programs and algorithms represents information on products at the time of publication of these 
materials, and are subject to change by Renesas Technology Corp. without notice due to 
product improvements or other reasons.  It is therefore recommended that customers contact 
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for 
the latest product information before purchasing a product listed herein. 
The information described here may contain technical inaccuracies or typographical errors. 
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss 
rising from these inaccuracies or errors. 
Please also pay attention to information published by Renesas Technology Corp. by various 
means, including the Renesas Technology Corp. Semiconductor home page 
(http://www.renesas.com). 

4.  When using any or all of the information contained in these materials, including product data, 

diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total 
system before making a final decision on the applicability of the information and products.  
Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss 
resulting from the information contained herein. 

5.  Renesas Technology Corp. semiconductors are not designed or manufactured for use in a 

device or system that is used under circumstances in which human life is potentially at stake.  
Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product 
distributor when considering the use of a product contained herein for any specific purposes, 
such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or 
undersea repeater use. 

6.  The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce 

in whole or in part these materials. 

7.  If these products or technologies are subject to the Japanese export control restrictions, they 

must be exported under a license from the Japanese government and cannot be imported into a 
country other than the approved destination. 
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or 
the country of destination is prohibited. 

8.  Please contact Renesas Technology Corp. for further details on these materials or the products 

contained therein. 

Содержание BP-272

Страница 1: ...ok over all the business of both companies Therefore although the old company name remains in this document it is a valid Renesas Electronics document We appreciate your understanding Renesas Electron...

Страница 2: ...t for an application categorized as Specific or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics The quality grade of each Renesas...

Страница 3: ...SH7058 Group BP 272 User System Interface Board HS7058ECB61H User s Manual User s Manual Rev 3 0 2004 03 Renesas Microcomputer Development Environment System SuperH Family SH7050 Series...

Страница 4: ...described here may contain technical inaccuracies or typographical errors Renesas Technology Corp assumes no responsibility for any damage liability or other loss rising from these inaccuracies or err...

Страница 5: ...er system interface board must only be used for the above purpose Improvement Policy Renesas Technology Corp including its subsidiaries hereafter collectively referred to as Renesas pursues a policy o...

Страница 6: ...om you Renesas is not liable for any claim made by a third party or made by you for a third party DISCLAIMER RENESAS MAKES NO WARRANTIES EITHER EXPRESS OR IMPLIED ORAL OR WRITTEN EXCEPT AS PROVIDED HE...

Страница 7: ...rt may be reproduced or duplicated in any form in hard copy or machine readable form by any means available without Renesas prior written consent Other Important Things to Keep in Mind 1 Circuitry and...

Страница 8: ...low this symbol to avoid possible injury or death DANGER DANGER indicates an imminently hazardous situation which if not avoided will result in death or serious injury WARNING WARNING indicates a pote...

Страница 9: ...n PERSONAL INJURY The USER PROGRAM will be LOST 1 Do not repair or remodel the emulator product by yourself for electric shock prevention and quality assurance 2 Always switch OFF the E6000H emulator...

Страница 10: ...i Preface The HS7058ECB61H is a user system interface board that connects a user system for the SH7058 BP 272 package to the SH7058 E6000H emulator HS7058EPH60H...

Страница 11: ...t Connector 6 2 2 Exchanging the Spacer of the EV Chip Board 7 2 3 Connecting User System Interface Board to EV Chip Board 8 2 4 Recommended Dimensions for User System Mount Pad Footprint 10 2 5 Dimen...

Страница 12: ...components of the user system interface board for the BP 272 package Please make sure you have all of these components when unpacking EV chip board Spacer Screws M2 x 8 mm Board Pin 1 IC socket User...

Страница 13: ...Quantity Remarks 1 Board 1 2 IC socket 1 For the BP 272 package installed on the user system CSPACK256Z2021H01 3 Spacer 1 For installing a BP 272 packaged MCU 4 Cover 1 For installing a BP 272 package...

Страница 14: ...older within 100 to 150 m Too much solder will cause short circuiting of the pins 2 The IC socket is vacuum packed to avoid oxidization of the surfaces of the solder balls It is thus recommended that...

Страница 15: ...c Since the IC socket has a greater volume than the IC package it is recommended that the temperature profile under the conditions used in installation be measured by attaching a temperature sensor t...

Страница 16: ...d to the guide pins from the back of the user system board stress will be applied to the soldered part of the IC socket and this may destroy the connectors Do not apply any load to the guide pins afte...

Страница 17: ...es not operate correctly cracks might have occurred in the solder Check conduction with a tester and re solder the IC socket if necessary Fasten the user system interface board to the IC socket and th...

Страница 18: ...board is connected to the user system force must not applied to the user system Exchange the spacer 2 6MP x 10 mm of the EV chip board with another spacer 2 6MP x 25 mm provided for the user system i...

Страница 19: ...ser system and the emulator product before the USER SYSTEM INTERFACE BOARD is connected to or removed from any part Before connecting make sure that pin 1 on both sides are correctly aligned 2 The use...

Страница 20: ...9 Connector No UCN1 UCN1 UCN2 UCN2 Board EV Chip Board Connector No Board Connector No EV chip board Figure 4 Connecting User System Interface Board to EV Chip Board...

Страница 21: ...t for the user system with an IC socket for an BP 272 package CSPACK256Z2021H01 manufactured by Tokyo Eletech Corporation Note that the dimensions in figure 6 are somewhat different from those of the...

Страница 22: ...for the EV chip board and the user system interface board are shown in figure 6 120 0 5 0 8 0 100 0 84 0 Top view 16 0 100 0 84 5 69 0 34 5 50 0 65 0 70 0 Unit mm Tolerance 0 5 mm EV chip board Spacer...

Страница 23: ...nnecting the user system interface board to the user system are shown in figure 7 IC socket Tokyo Eletech Corporation CSPACK256Z2021H01 User system EV chip board Spacer 6 0 65 0 45 0 45 0 65 0 28 4 8...

Страница 24: ...CU clock For details refer to the SH7058 E6000H Emulator User s Manual HS7058EPH60HE To use the emulator internal clock Select the clock in the emulator by the CLOCK command emulator command To use th...

Страница 25: ...nted on the EV chip board Install a crystal oscillator into the crystal oscillator terminals on the EV chip board EV chip board Crystal oscillator terminals Crystal oscillator Enlarged view X1 X2 Figu...

Страница 26: ...em interface board while it is connected to the user system 4 The dimensions of the recommended mount pad for the IC socket for this user system interface board are different from those of the MCU 5 T...

Страница 27: ...n Date Rev 2 00 November 20 2003 Rev 3 00 March 1 2004 Published by Sales Strategic Planning Div Renesas Technology Corp Edited by Technical Documentation Information Department Renesas Kodaira Semico...

Страница 28: ...1753 Shimonumabe Nakahara ku Kawasaki shi Kanagawa 211 8668 Japan SH7058 Group BP 272 User System Interface Board REJ10B0088 0300H HS7058ECB61H User s Manual...

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