Rastergraf
2-6 Specifications
The Garnet and Duros are full CCPMC versions and as
such are available ONLY with rear panel access.
Care must be exercised in the use of rear panel, especially
with LVDS and DVI, which require matched length pairs
and signal impedance of 50 ohms differential. Most carrier
and CPU boards were not designed for use with these
graphics boards and will therefore not take into account
these special needs. Please contact Rastergraf for assistance
before committing to a rear panel access system design.
Note that as of the time of writing, there are no rear panel
cables, PIM adapters, PMC carriers, or any other hardware
aids available from Rastergraf that might be used as part of
a rear panel system integration effort.
Ruggedization Option:
Rastergraf is not in the militarized business, but it does
offer ”ruggedized” versions, which are the Garnet and
Duros.
As compared to a full ruggedized products supplied by
such companies as CWCEC and GE Fanuc which use mil-
grade components and provide full component level
traceability, Rastergraf board designs use standard
distribution grade
derated commercial temperature range
or industrial temperature range components . No formal
component tracking is maintained.
The board is protected with a conformal coating. It is
Miller Stephenson MS-460A spray-on, and is MIL-I-
46058C, Type SR and MIL-T-152B compliant. The board
is tested under extended temperature conditions:
Temperature: -40 to +85º C, operating
-55 to +125º C, storage
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