RAKINDA SCANMAX M5 Скачать руководство пользователя страница 9

深圳市远景达物联网技术有限公司

Shenzhen RakindaTechnology Co., Ltd.

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3. The entire motherboard conducts heat to the heat sink (the heat sink is a whole) through a thermally
conductive silicone sheet (without viscosity). The thermal conductivity of the thermally conductive
adhesive is 3W / mk and the thickness is 1mm and the module presses the thermally conductive silicone
sheet. However, it should be noted that the pressure should be controlled within the compression amount
of the thermal conductive glue to prevent the chip from being crushed;
4

The ambient temperature of the equipment doesn

t exceed 45

;

5: When installing the radiator, please pay attention not to contact with other components of the
motherboard to prevent damage to the motherboard due to short circuit
6: It is forbidden to stick tape and other materials that affect heat dissipation on the motherboard and
bracket, so as not to cause the motherboard temperature to be too high and affect product performance.

Installation location of thermally conductive silicone sheet

Examples of fixing methods:

Example 1: Add a radiator on the back:

Example 2: Conduct heat to the rear shell:

Содержание SCANMAX M5

Страница 1: ...Shenzhen RakindaTechnology Co Ltd 1 13 RAKINDA SCANMAX 3D TOF Depth Camera M5 User Manual Document Version V1 4 Confidential Open...

Страница 2: ...sumption data 2019 03 16 V1 2 1 Add interface description and radiating design guide 2019 04 08 V1 3 1 Adjust size thickness changed to 10 6mm and update diagram 2 The max ideal working distance adjus...

Страница 3: ...on records 2 Product Brief 4 Product Introduction 5 2 1 Product Specs 5 2 2 Firmware Components 6 2 3 Product Structure Size 6 2 4 Interface Description 7 2 5 Module Radiating Design Guide 8 Functions...

Страница 4: ...ndheld detection terminal application to realize facial recognition face liveness detection scenerecognition and gestures recognition We provide SDK Users can make product integration and secondary de...

Страница 5: ...em Windows7 or above Linux Android Dimension length x width x thickness mm 55 18 10 6 module without steel fixture 65 8 18 10 6 module with steel fixture Note 1 measurement distance testing with 90 re...

Страница 6: ...M5 modulestructure size Figure 2 M5 structure size 1 Fixing Instruction 1 If the customer s product is a metal material the module can be fixed to the product through two fixed steel sheets on the mo...

Страница 7: ...stallation needs to have enough of the bearing surface cannot affect the safe use in the case of address security thinned as far as possible suggest 1 mm thickness in order to prevent the VCSEL infrar...

Страница 8: ...1 Because the product volume is too small the chip temperature is relatively high heat conduction treatment is required to avoid excessive temperature to reduce product life you can add a radiator on...

Страница 9: ...conductive glue to prevent the chip from being crushed 4 The ambient temperature of the equipment doesn t exceed 45 5 When installing the radiator please pay attention not to contact with other compo...

Страница 10: ...n RakindaTechnology Co Ltd 10 13 For the long rear shell in the above figure a layer of graphene can be attached inside the shell to quickly and evenly spread the heat to avoid local overheating of th...

Страница 11: ...unctions Introduction 1 Depth data output output unit16 depth data 2 IR image data output output 8bit infrared intensity map 3 RGB image output output JPEG or 24 bit RGB data 4 Synchronization and ali...

Страница 12: ...ve Arm Cortex A8 and above C Memory More than 64MB D External storage More than 250MB E Interface Micro USB 2 0 F Development environment VS2010 VS2015 Eclipse Android Studio G Graphics Some sample pr...

Страница 13: ...ep vision inspection scenarios mainly including Industry Application Somatosensory entertainment Somatosensory games bone extraction 3D fitting gesture recognition etc Face recognition Face payment fa...

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