4
Thermal Solutions
42
Heat spreader
The CE-HSPA aluminium heat spreader is compliant with the
PIGMG COM Express Base
Specification Revision 1.0
. This heat spreader is specifically designed as an interface to
custom thermal solutions for all CE915GM modules.
This heat spreader can also be used by itself as a standalone thermal solution for the CE-
760A model, where there is a 25°C thermal margin when the ambient temperature
reaches 60°C.
W
ARING
!
Do not use this heat speader with other CE915GM models as a standalone
thermal solution, as it will result in much lower thermal performance at a higher cost than
the other one-piece heatsink designs described in this chapter.
Thermal interface materials
A thermal interface material (TIM) should be applied to the processor interface surfaces to
ensure maximum contact with the BGAs. Different thermal interface materials are
available.
•
Good: Thermal Pad — a thick, clay-like gap filler limited to 10W TDP processors. For
information about the TDP of main thermal resources, see
Thermal design power on
page 21
.
•
Better: Thermal Grease — messy, but does not require a phase change cycle.
•
Best: Phase Change Material — requires one 60°C thermal cycle to achieve full
performance. If your application requires the fastest CPU speed, a high ambient
temperature, and a workload at or exceeding the TDP, phase change material is
required.
RadiSys offers a phase-change thermal interface material (RadiSys product code CE-TIM),
which phase changes at 58°C.
Table 6
shows the recommended providers of thermal interface materials.
For detailed instructions on how to apply the thermal interface material and install the
cooling system, refer to the
Quick Start Guide
.
Table 6. Recommended thermal interface materials
Manufacturer
Part Number
Description
Power devices
Thermstrate-TC
Applicator bar, phase change TIM (thermal interface material)
Loctite
Thermstrate-TC
Applicator bar, phase change TIM (thermal interface material)
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