HC4
CSPWRSENHC5 - 3 / 4
Appendice Tecnica
Rev. 1.0 - 01/04/02
CSPWRSENHC5
Bill Of Materials
Page1
Item
Q.ty
Reference
Part
Description
_________________________________________________________________________________
1
2
C2,C1
27p
Cond. chip 0805
2
6
C3,C4,C11,C12,C17,C20
4n7
Cond. chip 0805
3
18
D1,D2,D3,R4,R5,C5,R6,C6,
*
N.C.
C7,C8,C9,R11,R13,R14,C14,
R15,C15,C16
4
1
C10
1n0
1n0
5
2
C13,R16
10H
???
6
1
C18
0.1u
Cond. chip HQ
7
1
C19
10u
Cond. chip tant.
8
1
D4
2800
Diode smd
9
1
JP1
CN04PS
10
2
RA,RB
100H 800W
Res. KDI 800W
11
3
R1,R3,R9
150
Res. chip 0805 1%
12
1
R2
4K7
Res. chip 0805 1%
13
2
R12,R7
2K7
Res. chip 0805 1%
14
2
R8,R10
2K2
Res. chip 0805 5%
15
1
U1
LM358S
Circ. int. digitale
Содержание HC4
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