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SC20-A_Manual_R1.0 Confidential / Released 42 / 57
Figure 8: Recommended Stencil Design for LGA Pads
Time
50
100
150
200
250
300
50
100
150
200
250
160
ºC
200
ºC
217
0
70s~120s
40s~60s
Between 1~3
ºC
/s
Preheat
Heating
Cooling
ºC
s
Liquids Temperature
T
e
m
p
e
ra
tu
re
Figure 9: Reflow Soldering Thermal Profile
It is suggested that the peak reflow temperature is from 235 to 245ºC (for SnAg3.0Cu0.5 alloy). The
absolute maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated
heating, it is suggested that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below:
1.5mm
1
.5
m
m
0
.5
5
m
m
0.55mm