5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
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6.3. I/O Requirements
Table 33: I/O Requirements
1)
V
DD18
is the I/O power domain of the module.
6.4. Operating and Storage Temperatures
Table 34: Operati
o
n
g
and Storage Temperatures
1.
1)
To meet this operating temperature range, you need to ensure effective thermal dissipation, for
example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,
the module meets 3GPP specifications.
2.
2)
To meet this extended temperature range, you need to ensure effective thermal dissipation, for
example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,
the module remains the ability to establish and maintain functions such as voice, SMS, emergency
call, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not
Parameter
Description
Min.
Max.
Unit
V
IH
Input high voltage
0.7 × V
DD18
1)
V
DD18
+0.3
V
V
IL
Input low voltage
-0.3
0.3 × V
DD18
V
V
OH
Output high voltage
V
DD18
-0.5
V
DD18
V
V
OL
Output low voltage
0
0.4
V
Parameter
Min.
Typ.
Max.
Unit
Operating Temperature Range
1)
-20
+25
+60
ºC
Extended Temperature Range
2)
-40
+85
ºC
Storage temperature Range
-40
+90
ºC
NOTES
NOTE
