GSM/GPRS Module Series
M66 Hardware Design
M66_Hardware_Design Confidential / Released 50 / 80
The reference circuit for a 6-pin SIM card socket is illustrated as the following figure.
Module
SIM_VDD
SIM_GND
SIM_RST
SIM_CLK
SIM_DATA
22R
22R
22R
100nF
SIM_Holder
GND
TVS
33pF33pF 33pF
VCC
RST
CLK
IO
VPP
GND
GND
33pF
Figure 33: Reference Circuit for SIM Interface with the 6-pin SIM Card Holder
For more information of SIM card holder, you can visit http://www.amphenol.com and
http://www.molex.com .
In order to enhance the reliability and availability of the SIM card in application. Please follow the below
criteria in the SIM circuit design:
Keep layout of SIM card as close as possible to the module. Assure the possibility of the length of the
trace is less than 200mm.
Keep SIM card signal away from RF and VBAT alignment.
Assure the ground between module and SIM cassette short and wide. Keep the width of ground no
less than 0.5mm to maintain the same electric potential. The decouple capacitor of SIM_VDD is less
than 1uF and must be near to SIM cassette.
To avoid cross talk between SIM_DATA and SIM_CLK. Keep them away with each other and shield
them with surrounded ground.
In order to offer good ESD protection, it is recommended to add a TVS diode array. For more
information of TVS diode, please visit http://www.onsemi.com/. The most important rule is to place
the ESD protection device close to the SIM card socket and make sure the nets being protected will
go through the ESD device first and then lead to module. The 22Ω resistors should be connected in
series between the module and the SIM card so as to suppress the EMI spurious transmission and
enhance the ESD protection. Please to be noted that the SIM peripheral circuit should be close to the
SIM card socket.
Place the RF bypass capacitors (33pF) close to the SIM card on all signals line for improving EMI.
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