M50 Hardware Design
M50_HD_V2.0
- 86 -
Time(s)
50
100
150
200
250
300
50
100
150
200
250
160
℃
200
℃
217
0
70s~120s
40s~60s
Between 1~3
℃
/S
Preheat
Heating
Cooling
℃
s
Liquids Temperature
Figure 57
:
Ramp-Soak-Spike reflow profile
7.3. Packaging
M50 modules are distributed in trays of 20 pieces each. This is especially suitable for the M50
according to SMT processes requirements.
The trays are stored inside a vacuum-sealed bag which is ESD protected. It should not be opened
until the devices are ready to be soldered onto the application.
Figure 58
:
Module tray
Quecctel
Confidential