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LCC/LGA Module Series

Module Secondary SMT User Guide

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Desoldering

Please use a heat gun to heat the solder joints so as to remove the module from the motherboard.

⚫

The temperature of the heat gun should be about 350ºC in order to release enough heat. The wind

speed should be adjusted according to actual situation.

⚫

If the motherboard has been exposed to the air for exceeding 72 hours, then it should be baked

before desoldering.

⚫

During heating, the motherboard should be laid flat and fixed to avoid movement, and the distance

between the motherboard and the nozzle should be from 1.0cm to 3.5cm.

⚫

Move the nozzle along the edge of the module at a constant speed. When all of the solder joints are

melted off, take off the module along the diagonal direction with tweezers. The time of the whole

process should be no more than 120 seconds.

For the module larger than 33.0mm×33.0mm, a BGA workbench or heat gun can be used to desolder

components. To prevent separation between pad and circuit as well as PCB blistering caused by

long-term heating on a single side, pre-heating is needed at the bottom side of the module when heat gun

is used for desoldering. It is recommended to inspect soldering quality of modules by X-rays.

Table 3: Heat Gun Desoldering Requirements

Parameters

Requirements

The maximum temperature

on the surface of PCB

260°C

Desoldering or soldering

time limit

40s-120s

Temperature measurement

and calibration

⚫

Use temperature measurement devices in calibration period to

measure the temperature (the heat gun temperature must be set

according to the actually soldering requirements).

⚫

The temperature must not exceed 350°C.

⚫

Temperature check point must be 5mm away from the nozzle of the

heat gun, and the nozzle must be placed vertically down when

measuring.

⚫

Heat guns that cannot meet the temperature requirements are

prohibited to be used.

⚫

Heat gun should be detected with grounding.

Nozzle shape and

dimensions

Select an appropriate nozzle according to the type of electronic

components.

Содержание LCC Series

Страница 1: ...Module Secondary SMT User Guide LCC LGA Module Series Rev Module_Secondary_SMT_User_Guide_V2 5 Date 2019 03 11 Status Released www quectel com ...

Страница 2: ... INFORMATION PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE...

Страница 3: ...rements for M66 M66 DS MC60 L70 R L70 RL L76 L L76B L80 R L86 L96 EC20 R2 0 EC21 EC25 EG91 EG95 BG96 FC10 FC20 SC10 SC20 SG30 AG35 modules in Chapter 4 2 2 Added desoldering and repair instructions in Chapter 5 and 6 2 4 2018 06 02 Rowan WANG Alain HUANG 1 Updated the MSL rating of Quectel modules into 3 2 Updated stencil design requirements in Chapter 4 2 3 Optimized the recommended reflow solder...

Страница 4: ... Surface Mount Packaging Type 7 2 2 Packing Methods 7 3 Requirements on Chip Mounter 8 3 1 Chip Mounter 8 3 2 Soldering Requirements 8 4 Attentions for Manufacturing 9 4 1 MSL and Moisture proof Requirement 9 4 2 Stencil Design Requirements 10 4 3 Mounting Process 18 4 3 1 Load Materials 18 4 3 2 Automatic Placement 19 4 4 Reflow Soldering 20 5 Desoldering 22 6 Repair Instructions 24 7 Appendix Re...

Страница 5: ...ary SMT User Guide Module_Secondary_SMT_User_Guide 4 25 Table Index TABLE 1 STENCIL DESIGN REQUIREMENTS 10 TABLE 2 RECOMMENDED THERMAL PROFILE PARAMETERS 20 TABLE 3 HEAT GUN DESOLDERING REQUIREMENTS 22 TABLE 4 TERMS AND ABBREVIATIONS 25 ...

Страница 6: ...re Index FIGURE 1 TAPE REEL PACKING 7 FIGURE 2 HUMIDITY INDICATOR CARD 9 FIGURE 3 STEP UP STENCIL AREA 18 FIGURE 4 AUTOMATIC PLACEMENT 19 FIGURE 5 FIRST PIN AND MOUNTED PICTURE 19 FIGURE 6 RAMP SOAK SPIKE REFLOW PROFILE 20 FIGURE 7 REMOVE MODULE 23 FIGURE 8 MODULE SOLDERING QUALITY INSPECTION 23 ...

Страница 7: ...e Secondary SMT User Guide Module_Secondary_SMT_User_Guide 6 25 1 Introduction This document describes the process of Quectel modules secondary SMT and desoldering It is applicable to all Quectel modules in LCC or LGA form factor ...

Страница 8: ... Module_Secondary_SMT_User_Guide 7 25 2 Information about Modules 2 1 Surface Mount Packaging Type Quectel modules adopt LCC or LGA package 2 2 Packing Methods Quectel provides tape and reel pack as shown in the following figure Figure 1 Tape Reel Packing ...

Страница 9: ...s shorter side For example if the module size is 25mm 20mm the nozzle diameter should be 8mm at least 3 2 Soldering Requirements 1 It is recommended to use reflow soldering equipment with eight zones at least For Quectel LTE LPWA Automotive and Smart series modules reflow soldering equipment with at least ten zones is recommended 2 In a lead free reflow oven the peak temperature of the actual sold...

Страница 10: ...odules is defined as 3 Please make sure the package is intact before using After opening the package please confirm the status of humidity indicator card in the vacuum sealed package To prevent the module from permanent damage baking before reflow soldering is required if any circumstance below occurs Humidity indicator card At least one circular indicator is no longer blue The seal is open and th...

Страница 11: ...than 2 0mm 2 0mm by 0 3 0 5mm shelves There is no need of opening for arc shaped pad near regular pads if there is any component a clearance of over 1mm should be left between outward end of the aperture and the component The stencil design requirements for Quectel modules are shown in the table below Diagrams in the table are only typical examples of corresponding modules Diagrams of different mo...

Страница 12: ...0 20mm and the outermost edge should be shifted outward by 0 40 0 60mm and the width should be reduced in a ratio of 1 0 85 The shape should be rectangle with round chamfers 3 For pads in the center The stencil aperture area for each single pad should be 70 of that of the corresponding pad and the shape should be round BC95 BC95 G 1 The stencil thickness of the area for the module should be partly...

Страница 13: ...artly stepped up to 0 18 0 20mm 2 For pads on four sides The innermost edge of the aperture for each single pad should be shifted outward by 0 20mm and outermost edge should be shifted outward by 0 40 0 60mm while the width should be reduced in a ratio of 1 0 85 And the shape should be rectangle with round chamfers 3 For pads in the center The stencil aperture for each pad should be centered with ...

Страница 14: ...ngle with round chamfers 3 For GND pads in the center Design the stencil aperture for each pad into four smaller 1 00mm 0 65mm apertures shaped in 0 05mm square with round chamfers and with clearance of 0 25mm in between 4 Design round apertures with diameter of 0 70mm for the pads in the yellow box 5 The 12 pins in the very center are used for R D test and recommended to be kept intact EG25 G 1 T...

Страница 15: ... to 0 13 0 15mm 2 For pads on four sides The aperture for each single pad should be centered with area reduced to 75 85 And the shape should be rectangle with round chamfers 3 For square pads in the center The aperture for each single pad should be designed into round and centered with area reduced to 70 4 For pads at four corners The stencil aperture should be designed into diagonal patterned lin...

Страница 16: ... for the arc shaped pad in blue box SC60 SC600T SC600Y 1 The stencil thickness of the area for the module should be partly stepped up to 0 18 0 20mm 2 For pads on four sides in blue boxes the innermost edge of the aperture for each single pad should be shifted outward by 0 20mm and the outermost edge should be shifted outward by 0 60 0 80mm while the width should be reduced in a ratio of 1 0 85 An...

Страница 17: ...h area reduced to 70 5 For pads at four corners the stencil aperture should be designed into diagonal patterned lines with 60 area of the corresponding pad 6 For the pad marked with red arrow The aperture should be centered with area reduced to 70 80 AG35 1 The stencil thickness of the area for the module should be partly stepped up to 0 13 0 15mm 2 The stencil aperture area for the pads on four s...

Страница 18: ...a for the module should be partly stepped up to 0 15 0 18mm 2 The innermost edge of the aperture for each single pad should be shifted outward by 0 20mm and the outermost edge should be shifted outward by 0 40mm and the width should be reduced in a ratio of 1 0 85 and should be designed with round chamfers 3 There is no need to design stencil apertures for the arc shaped pad in blue box FC20 1 The...

Страница 19: ...d be reduced by 10 30 compared with regular apertures since the thickening will increase the volume of solder paste For components with 0 5mm pitch or smaller or 0201 components please keep at least 3mm space in between otherwise there may be a risk of solder bridging that will cause short circuit of the component 3 You can optimize the stencil design depending on the actual situation 4 Inward shr...

Страница 20: ...ule s stability please ensure that the nozzle is placed in the center of gravity image detection and recognition are 100 passed and keep a medium speed when mounting the module After the module is placed onto the motherboard the module pads should be in alignment with the corresponding solder paste on the motherboard s pads The triangle mark on the module indicates its first pin which should corre...

Страница 21: ... Zone Soak Zone 245 200 220 238 C D B A 150 100 Max slope 1 3 C sec Cooling down slope 1 4 C sec Max slope 2 3 C sec Figure 6 Ramp soak spike Reflow Profile Table 2 Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1 to 3 C sec Soak time between A and B 150 C and 200 C 60 to 120 sec Reflow Zone Max slope 2 to 3 C sec Reflow time D over 220 C 40 to 60 sec Max temperat...

Страница 22: ...hields and laser engraved labels During manufacturing and soldering or any other processes that may contact the module directly NEVER wipe the module s shielding can with organic solvents such as acetone ethyl alcohol isopropyl alcohol trichloroethylene etc Otherwise the shielding can may become rusted The shielding can for the module is made of Cupro Nickel base material It is tested that after 1...

Страница 23: ...BGA workbench or heat gun can be used to desolder components To prevent separation between pad and circuit as well as PCB blistering caused by long term heating on a single side pre heating is needed at the bottom side of the module when heat gun is used for desoldering It is recommended to inspect soldering quality of modules by X rays Table 3 Heat Gun Desoldering Requirements Parameters Requirem...

Страница 24: ...Figure 7 Remove Module After desoldering wait a moment until the module and the motherboard cool down When the module has been removed please guarantee that the solder paste on the motherboard must be smooth and there is no short circuit between two pins Figure 8 Module Soldering Quality Inspection For the rework requirements of Quectel AG35 module please refer to Quectel_AG35_Secondary_ SMT_Guide...

Страница 25: ...mes maximally Re soldering or spot soldering by soldering iron is not regarded as one repair and soldering by heat gun will be defined as one repair Normally PCBA will be heated twice for every repair desoldering and soldering and thus the maximum repair time for each PCBA is 3 If the module is not restored after three times repairing it is recommended to be scrapped For the rework requirements of...

Страница 26: ...condary_SMT_User_Guide 25 25 7 Appendix Reference Table 4 Terms and Abbreviations Abbreviation Description LCC Leadless Chip Carriers LGA Land Grid Array MSL Moisture Sensitivity Level PCB Printed Circuit Board SMD Surface Mount Device SMT Surface Mount Technology ...

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