LTE Module Series
EC25-V User Manual
EC25-V_User_Manual
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8
Storage and Manufacturing
8.1. Storage
EC25 is stored in a vacuum-sealed bag. The restrictions of storage condition are shown as below.
1. Shelf life in sealed bag is 12 months at < 40ºC/90%RH.
2.
After this bag is opened, devices that will be subjected to reflow soldering or other high temperature
processes must be:
Mounted within 72 hours at factory conditions of ≤ 30ºC/60%RH.
Stored at <10% RH.
3. Devices require bake before mounting, if:
Humidity indicator card is >10% when ambient temperature is 23ºC±5ºC.
Mounted for more than 72 hours at factory conditions of ≤ 30ºC/60% RH.
4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.
As plastic container cannot be subjected to high temperature, the module needs to be taken out from the
container for high temperature (125ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
8.2. Manufacturing and Welding
The squeegee should push the paste on the surface of stencil, so as to make the paste fill the stencil
openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a
clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at
the hole of the module pads should be 0.18mm. For details, please refer to
document [4]
.
It is suggested that the peak reflow temperature is 235 ~ 245ºC (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 260ºC. To avoid damage to the module when it is repeatedly heated, it is
NOTE
