NB-IoT
Module Series
BC660K-GL Hardware Design
BC660K-GL_Hardware_Design 48 / 57
3.
7
0.
7
1.1
17.7
15.8
4.4
1.5
3.5
1.0
4.35
4.3
1.
8
1.
9
2.25
4.4
±0.15
±
0.15
0.
7
Figure 28: Bottom Dimension (Bottom View)
The package warpage level of the module conforms to JEITA ED-7306 standard.
Pin 1
NOTE