Quectel AF20, Проектирование аппаратного обеспечения

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Wi-Fi&Bluetooth Module Series
AF20_Hardware_Design 9 / 49
Figure Index
Figure 1: Functional Diagram ............................................................................................................................. 13
Figure 2: Pin Assignment (Top View) ................................................................................................................. 15
Figure 3: Reference Circuit for VDD_3V3 .......................................................................................................... 20
Figure 4: Turn-on and Turn-off Timing ................................................................................................................20
Figure 5: Wi-Fi Application Interface Connection ...............................................................................................21
Figure 6: SDIO Interface Connection ................................................................................................................. 23
Figure 7: Block Diagram of Bluetooth Application Interface Connection ........................................................... 24
Figure 8: Reference Design for PCM Interface .................................................................................................. 25
Figure 9: Reference Design for Bluetooth UART Connection ............................................................................25
Figure 10: Coexistence UART Connection ........................................................................................................ 26
Figure 11: Reference Circuit for RF Antenna Interface ...................................................................................... 28
Figure 12: Reference Design of RF Antenna Interface (Vehicle Applications) ...................................................28
Figure 13: Microstrip Design on a 2-layer PCB ..................................................................................................29
Figure 14: Coplanar Waveguide Design on a 2-layer PCB ................................................................................29
Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ............................ 29
Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ............................ 29
Figure 17: Dimensions of the Receptacle (Unit: mm) ........................................................................................ 31
Figure 18: Specifications of Mated Plugs (Unit: mm) .........................................................................................31
Figure 19: Space Factor of the Mated Connectors (Unit: mm) .......................................................................... 32
Figure 20: Top and Side Dimensions ................................................................................................................. 38
Figure 21: Bottom Dimensions (Bottom View) ................................................................................................... 39
Figure 22: Recommended Footprint ...................................................................................................................40
Figure 23: Top and Bottom Views of the Module ................................................................................................41
Figure 24: Recommended Reflow Soldering Thermal Profile ............................................................................43
Figure 25: Carrier Tape Dimension Drawing ...................................................................................................... 45
Figure 26: Plastic Reel Dimension Drawing .......................................................................................................46
Figure 27: Packaging Process ........................................................................................................................... 47