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FC2251101-00 D
B-1
Appendix B
Specifications
Table B-1. QLA23xx Board Operating Environment
Environment
Minimum
Maximum
Operating temperature
0
°
C/32
°
F
55
°
C/131
°
F
Storage temperature
-20
°
C/-4
°
F
70
°
C/158
°
F
Relative humidity (noncondensing)
10%
90%
Storage humidity (noncondensing)
5%
95%
Table B-2. QLA23xx Board Specifications
Type
Specification
Host bus
Conforms to PCI Local Bus Specification, revision 2.2 and the PCI-X
Addendum, revision 1.0
PCI/PCI-X
signaling
environment
3.3 V and 5.0 V buses supported
PCI/PCI-X
transfer rate
132 MBps maximum burst rate for 32-bit PCI operation at 33 MHz
264 MBps maximum burst rate for 32-bit PCI/PCI-X operation at 66 MHz
264 MBps maximum burst rate for 64-bit PCI operation at 33 MHz
528 MBps maximum burst rate for 64-bit PCI/PCI-X operation at 66 MHz
1GBps maximum burst rate for 64-bit PCI-X operation at 133 MHz
(QLA2312F/2312FL)
Fibre
Channel
specifications
Bus type: Copper media, twisted pair (QLA2300/QLA2310)
Multimode fibre optic media (QLA2300F/QLA2302F/QLA2310F/
QLA2312F/QAL2312FL)
Bus transfer rate: 200 MBps maximum at half-duplex
400 MBps maximum at full-duplex
Interface chip: ISP2300 (PCI QLA2300/2300F/2302F boards)
ISP2310 (PCI-X QLA2310/2310F/2310FL boards)
ISP2312 (PCI-X QLA2312F/2312FL boards)
CPU
Single-chip design that includes a QLogic RISC processor, Fibre Channel
protocol manager, PCI/PCI-X DMA controller, and integrated
serializer/deserializer (SERDES) and electrical transceivers that can
auto-negotiate a data rate of 1 Gbps or 2 Gbps
RAM
256 KB of sync SRAM supporting parity protection
BIOS ROM
128 KB of flash ROM in two 64-KB, software selectable banks. The flash
is field programmable.
Содержание SANblade QLA2300
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