STAMP-IMX6ULL
（
Stamp Module
）
Core Board Hardware Manual
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Page 13 of 30
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Website
:http://www.qiytech.com
©2012 Qiyangtech
Copyright
Inte
rf
ace
s
Display
Parallel LCD display (24Bit), resolution up to WXGA(1366x768)
UART
Support 6*UART
USB2.0
2* USB -Host
USB-OTG
1*USB-OTG
Ethernet
2* 100Mbps
CAN
2*CAN ( Can be configured to multiplex)
SDIO
Lead out 1*SDIO signal
SP
Lead out 3*SPI signal
I2C
Lead out 2*I2C bus signal
SAI
Lead out SAI/I2S signal
CSI
Lead out CSI signal (Can be configured to multiplex)
GPIO
Several GPIO signal (Can be configured to multiplex)
M
echa
ni
cal
Par
am
et
ers
Dimension
40.13mmx53.34mm
Board To
Board
Connector
Stamp Module
PIN Spacing
1.016mm
Pad Size
1.524mm*0.762mm
Pin Number
166 PINS, to meet various extension requirements.
Craft
Adopts 6-layer PCB golden immersion technology
PCB Material High TG PCB material
C
ha
ract
eri
st
ics
Input Voltage
DC5V
Operation
Temperature
-20
℃
~ +70
℃（
Can be extended to industrial grade
）
Storage
Temperature
-20
℃
~ +70
℃
