PT AMC123, Руководство пользователя

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97
Chapter 8
Thermal Considerations
Overview
This chapter describes the thermal requirements to reliably operate an AMC123 processor
module. Key topics in this chapter include:
• “Thermal Requirements,” on page 97
• “Temperature Monitoring,” on page 97
Thermal Requirements
The maximum processor die temperature allowed by the Intel EP80579 Integrated Processor
on the AMC123 is 95° C.
Caution:
To avoid damaging the processor or other components on the module, do not exceed the
maximum processor core temperature!
The AMC123 comes from the factory equipped with an integrated heat sink to help dissipate
the heat generated by the processor. The maximum ambient air temperature required by the
heat sink to maintain core temperature below the maximum is 55° C. The maximum ambient air
temperature assumes airflow of 300 LFM past the heat sink.
Caution:
External airflow must be provided at all times during operation to avoid damaging the
processor. PT strongly recommends use of a fan tray below the card rack to supply the
external airflow.
Temperature Monitoring
Because reliable long-term operation of the AMC123 depends on maintaining proper
temperature, PT strongly recommends that you verify the operating temperature of the
processor (core) in your final system configuration.
The Intel EP80579 Integrated Processor incorporates an on-die thermal sensor that is used to
monitor the processor's die temperature and determine when the maximum specified
component temperature has been reached.
While the MMC checks the die temperature of the processor for thermal monitoring, it relies on
the Thermal Control Circuit (TCC) to manage the processor temperature.