27
GM-X1024,GM-X924
7.2 DISASSEMBLY
-
Removing the Heat Sink
Some silicone glue has been applied
between the Heat Sink and the Heat
Sink(Sub). therefore, to remove the Amp
Unit from the Heat Sink.
1. Remove two screws D.
2. Remove A LPF/HPF PCB and B LPF/HPF PCB.
3. Remove four screws E and eight screws F.
4. Use 2 pcs. of screw E and insert them into the
two holes marked with an arrow.
5. Alternately tighten them little by little until
the Heat Sink(Sub) separates from the Heat
Sink.
Fig. 14
-
Removing the Case and the Panel Unit
1. Remove eight screws A, seven screws B and
two screws C.
2. Remove Case and Panel Units.
Fig. 13
Case
Panel Unit
Panel Unit
Heat Sink(Sub)
B LPF/HPF PCB
Heat Sink(Sub)
Amp Unit
Heat Sink
A
C
A
B
A
B
A
A
A
A
A
B
B
B
B
B
C
D
D
E
E
E
E
F
F
F
F
F
F
F
F
A LPF/HPF PCB
