Application Note
4/7
PHYTEC Messtechnik GmbH 2017
3
Production settings
The Modules have the MSL Level 3, so it is required to store them adequately before soldering
(see IPC/JEDEC J-STD-033C). I.e. it’s recommended to store the modules shrink-wrapped in the
original packing or if the packing is opened to store them in a humidity reduced storage (rel.
humidity < 10%, T < 30° C / 86° F). The shelf life time in the sealed packaging amounts 12 months
at < 40° C and < 90 % rel. humidity.
3.1
Paste printing
For the paste printing we recommend at least a 100µ m stencil without pad reduction. We use
Type 4 paste.
Fig. 4 Paste printing (orange) without paste reduction, dimensions in mm
0.8
1.55
r = 0.36
