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1999 Feb 16

16

Philips Semiconductors

Preliminary specification

12-bit high-speed Analog-to-Digital
Converter (ADC)

TDA8767

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

°

C. The top-surface temperature of the

packages should preferable be kept below 230

°

C.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

•

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

•

For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

•

For packages with leads on four sides, the footprint must
be placed at a 45

°

 angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

°

C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

°

C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

°

C.

Содержание TDA8767

Страница 1: ...DATA SHEET Preliminary specification Supersedes data of 1997 Jun 27 File under Integrated Circuits IC02 1999 Feb 16 INTEGRATED CIRCUITS TDA8767 12 bit high speed Analog to Digital Converter ADC ...

Страница 2: ...DTV Imaging camera scanner Medical imaging Telecommunication Base station receiver GENERAL DESCRIPTION The TDA8767 is a bipolar 12 bit Analog to Digital Converter ADC for imaging or other applications It converts the analog input signal into 12 bit binary coded digital words at a maximum sampling rate of 30 MHz All digital inputs and outputs are CMOS compatible QUICK REFERENCE DATA SYMBOL PARAMETE...

Страница 3: ... 75 mm SOT307 2 10 TDA8767H 2 20 TDA8767H 3 30 Fig 1 Block diagram handbook full pagewidth MBH142 D11 MSB data outputs 19 21 D10 22 D9 23 D8 24 D7 25 D6 26 D5 27 D4 D3 28 29 42 43 39 VI 11 Vref SH VI D2 30 D1 31 D0 LSB 32 VCCO 33 IR 34 20 18 CMOS OUTPUTS LATCHES ANALOG TO DIGITAL CONVERTER CLOCK DRIVER 15 VCCD2 37 VCCD1 41 VCCA4 3 VCCA3 9 VCCA2 2 VCCA1 36 CLK CMOS OUTPUT OGND IN RANGE LATCH OE TC ...

Страница 4: ...put two s complement OE 19 output enable input CMOS level active LOW IR 20 in range output D11 21 data output bit 11 MSB D10 22 data output bit 10 D9 23 data output bit 9 D8 24 data output bit 8 D7 25 data output bit 7 D6 26 data output bit 6 D5 27 data output bit 5 D4 28 data output bit 4 D3 29 data output bit 3 D2 30 data output bit 2 D1 31 data output bit 1 D0 32 data output bit 0 LSB VCCO 33 o...

Страница 5: ...dbook full pagewidth TDA8767 MBH143 1 2 3 4 5 6 7 8 9 10 11 33 32 31 30 29 28 27 26 25 24 23 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 n c n c n c n c n c VCCA1 VCCA3 VCCA2 Vref AGND3 AGND2 n c n c n c n c IR D11 D10 DGND2 V CCD2 OE TC D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 OGND DGND1 AGND4 AGND1 V CCD1 V CCA4 V I V I n c VCCO CLK SH ...

Страница 6: ...al precautions appropriate to handling integrated circuits THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN MAX UNIT VCCA analog supply voltage note 1 0 3 7 0 V VCCD digital supply voltage note 1 0 3 7 0 V VCCO output supply voltage note 1 0 3 7 0 V VCC supply voltage difference VCCA VCCD 1 0 1 0 V VCCO VCCD 1 0 4 0 V VCCA VCCO 1 0 4 0 V VI input voltage referenced to AGND 0 3 VCCA V Vi p p...

Страница 7: ...VIL LOW level input voltage 0 0 8 V VIH HIGH level input voltage 2 0 VCCD V IIL LOW level input current Vclk 0 3VCCD 400 µA IIH HIGH level input current Vclk 0 7VCCD 100 µA Vclk VCCD 300 µA Zi input impedance fclk 30 MHz 2 kΩ Ci input capacitance fclk 30 MHz 2 pF TC SH AND OE REFERENCED TO DGND see Tables 3 and 4 VIL LOW level input voltage 0 0 8 V VIH HIGH level input voltage 2 0 VCCD V IIL LOW l...

Страница 8: ...clock frequency TDA8767H 1 10 MHz TDA8767H 2 20 MHz TDA8767H 3 30 MHz tCPH clock pulse width HIGH 8 5 ns tCPL clock pulse width LOW 8 5 ns Analog signal processing 50 clock duty factor Vi Vi 2 0 V Vref VCCA 2 V see Table 1 LINEARITY ILE integral non linearity fclk 4 MHz ramp input 3 0 4 0 LSB DLE differential non linearity fclk 4 MHz ramp input no missing codes 0 6 1 LSB OFER offset error VCCA VCC...

Страница 9: ...required for the input signal to be stabilized after a sharp full scale input square wave signal in order to sample the signal and obtain correct output data see Fig 5 4 Output data acquisition the output data is available after the maximum delay of td SIGNAL TO NOISE RATIO S N signal to noise ratio without harmonics fclk 30 MHz fi 4 43 MHz 61 dB Timing CL 15 pF note 4 see Fig 3 tds sampling delay...

Страница 10: ...5 2 5 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 4094 1 1 1 1 1 1 1 1 1 1 1 1 0 0 1 1 1 1 1 1 1 1 1 1 0 4095 3 0 2 0 1 1 1 1 1 1 1 1 1 1 1 1 1 0 1 1 1 1 1 1 1 1 1 1 1 overflow 3 0 2 0 0 1 1 1 1 1 1 1 1 1 1 1 1 0 1 1 1 1 1 1 1 1 1 1 1 CODE VI IR BINARY OUTPUTS TWO S COMPLEMENT OUTPUTS D11 to D0 D11 to D0 underflow 1 5 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1 5 1 0 0 0 0 0 0 0 0 ...

Страница 11: ...855 sample N 2 Vl DATA D0 to D11 t d t h CPH t CPL t HIGH LOW 50 HIGH LOW 50 DATA N 1 DATA N DATA N 1 DATA N 2 Fig 4 Timing diagram and test conditions of 3 state output delay time fOE 100 kHz handbook full pagewidth MBH144 50 50 HIGH LOW dZH t dHZ t 50 HIGH LOW dZL t dLZ t 10 90 output data VCCD 0V output data 3 3 kΩ 15 pF S1 VCCD TDA8767 OE OE TEST dLZ t dZL t dHZ t dZH S1 CCD V CCD V DGND DGND ...

Страница 12: ...uctors Preliminary specification 12 bit high speed Analog to Digital Converter ADC TDA8767 Fig 5 Analog input settling time diagram handbook full pagewidth MBD875 50 STLH t 5 ns code 0 code 1023 I 50 2 ns 50 5 ns STHL t 50 2 ns CLK V ...

Страница 13: ...der to obtain a middle voltage of 2 5 V see Table 1 To ensure a sufficient analog input stability the minimum current into these resistors must be about 1 mA 3 Vref must be decoupled to VCCA handbook full pagewidth MBH145 1 2 3 4 5 6 7 8 9 10 11 12 n c n c n c n c 13 14 15 16 17 18 19 20 21 22 IR D11 MSB D10 TDA8767H 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 26 25 24 23 27 D2 D1 D0 LSB 5 ...

Страница 14: ...oltage of 2 5 V on VI and VI see Table 1 To ensure a sufficient analog input stability the minimum current into these resistors must be about 1 mA 3 Vref must be decoupled to VCCA handbook full pagewidth MBH146 1 2 3 4 5 6 7 8 9 10 11 12 n c n c n c n c 13 14 15 16 17 18 19 20 21 22 IR D11 MSB D10 TDA8767H 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 26 25 24 23 27 D2 D1 D0 LSB 5 V D3 D4 D5 ...

Страница 15: ... 10 1 9 9 0 8 1 3 12 9 12 3 1 2 0 8 10 0 o o 0 15 0 1 0 15 DIMENSIONS mm are the original dimensions Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included 0 95 0 55 SOT307 2 95 02 04 97 08 01 D 1 1 1 10 1 9 9 HD 12 9 12 3 E Z 1 2 0 8 D e E B 11 c E H D ZD A ZE e v M A X 1 44 34 33 23 22 12 y θ A1 A Lp detail X L A 3 A2 pin 1 index D H v M B bp bp w M w M 0 2 5 5 mm scale...

Страница 16: ...r problems To overcome these problems the double wave soldering method was specifically developed If wave soldering is used the following conditions must be observed for optimal results Use a double wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave For packages with leads on two sides and a pitch e larger than or equal to 1 27 mm the foot...

Страница 17: ...r packages with a pitch e equal to or smaller than 0 5 mm DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully inde...

Страница 18: ...1999 Feb 16 18 Philips Semiconductors Preliminary specification 12 bit high speed Analog to Digital Converter ADC TDA8767 NOTES ...

Страница 19: ...1999 Feb 16 19 Philips Semiconductors Preliminary specification 12 bit high speed Analog to Digital Converter ADC TDA8767 NOTES ...

Страница 20: ...ue SUNNYVALE CA 94088 3409 Tel 1 800 234 7381 Fax 1 800 943 0087 Uruguay see South America Vietnam see Singapore Yugoslavia PHILIPS Trg N Pasica 5 v 11000 BEOGRAD Tel 381 11 62 5344 Fax 381 11 63 5777 For all other countries apply to Philips Semiconductors International Marketing Sales Communications Building BE p P O Box 218 5600 MD EINDHOVEN The Netherlands Fax 31 40 27 24825 Argentina see South...

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