Fieldbus Power Hub,Motherboard for Gateway and Power Supply Modules
3
1 Introduction................................................................................. 4
1.1
Contents................................................................................................ 4
1.2
Target Group, Personnel...................................................................... 4
1.3
Symbols Used ...................................................................................... 4
2 Product Specifications............................................................... 6
2.1
Overview and Application ................................................................... 6
2.2
System Components ........................................................................... 7
2.2.1
Motherboard ...................................................................................... 7
2.2.2
Gateway Modules HD2-GTR-4PA* ..................................................... 7
2.2.3
Power Supply Modules HCD2-FBPS-*............................................... 8
2.2.4
Diagnostic Modules ........................................................................... 8
2.3
Component Identity and Dimensions .............................................. 10
2.4
Technical Data .................................................................................... 10
3 Installation and Commissioning ............................................. 14
3.1
Mounting and Dismounting............................................................... 14
3.2
Mounting the Grounding Rail (ACC-MB-HSK)................................. 16
3.3
Shielding and Grounding .................................................................. 16
3.3.1
Connection to Equipotential Bonding System .................................. 17
3.4
Connection Layout............................................................................. 18
3.4.1
Connections..................................................................................... 21
3.5
Segment Termination......................................................................... 21
3.6
Host Connection ................................................................................ 21
3.7
Gateway Addressing .......................................................................... 21
4 Thermal Dissipation ................................................................. 22
5 Appendix ................................................................................... 24
5.1
Ordering Information ......................................................................... 24
5.2
Electromagnetic Compatibility Verification .................................... 24
5.3
Referenced Documents ..................................................................... 25
