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3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TH-58PH10BK / TH-58PH10EK
Содержание TH-58PH10BK
Страница 4: ...1 Applicable signals 4 TH 58PH10BK TH 58PH10EK ...
Страница 20: ...7 2 Location of Lead Wiring 2 The lead wiring is dressed as shown in figure 20 TH 58PH10BK TH 58PH10EK ...
Страница 23: ...8 4 Adjustment Volume Location 8 5 Test Point Location 23 TH 58PH10BK TH 58PH10EK ...
Страница 27: ...9 2 IIC mode structure following items value is sample data 27 TH 58PH10BK TH 58PH10EK ...
Страница 29: ...29 TH 58PH10BK TH 58PH10EK ...
Страница 31: ...31 TH 58PH10BK TH 58PH10EK ...
Страница 34: ...3 Remarks Above Fan function is operated during the fans are installed 34 TH 58PH10BK TH 58PH10EK ...
Страница 37: ...12 Option Setting 37 TH 58PH10BK TH 58PH10EK ...
Страница 66: ...NOTE TH 58PH10BK TH 58PH10EK 66 ...
Страница 67: ...14 Block and Schematic Diagram 14 1 Schematic Diagram Notes TH 58PH10BK TH 58PH10EK 67 ...
Страница 117: ...15 Exploded View and Replacement Parts List 15 1 Exploded View 117 TH 58PH10BK TH 58PH10EK ...
Страница 118: ...15 2 Escutcheon part location enlarged view 15 3 Fan part location enlarged view 118 TH 58PH10BK TH 58PH10EK ...
Страница 119: ...15 4 Cable relation 119 TH 58PH10BK TH 58PH10EK ...
Страница 120: ...15 5 Packing summary 120 TH 58PH10BK TH 58PH10EK ...
Страница 121: ...121 TH 58PH10BK TH 58PH10EK ...
Страница 122: ...15 6 Replacement Parts List Notes 122 TH 58PH10BK TH 58PH10EK ...