Operation manual for Narrow-pitch connectors P5KF
Panasonic Corporation
industrial.panasonic.com/ac/e/
©
Panasonic Corporation 2017
ACCTF1E-4
201704
- 10 -
4) Metal Mask Design
Since this connector is designed with low-profile, please pay attention to the
following precautions for reflow soldering
.
(1)
In addition to the amount of applied solder, the reflow-soldering environment and
temperature profile affect the finish quality after reflow soldering. Please make
sure to adjust the amount of solder applied after checking the finish quality in a
test run.
(2)
Compared with natural air reflow soldering, N2 reflow soldering can reduce
oxidization of the melted solder surface. This significantly improves the solder
wettability. Therefore, please make sure to apply an appropriate amount of solder
(3)
Do not apply an excessive amount of solder, otherwise, solder or flux may creep
near the contact section and reduce contact reliability or cause interference during
mating. Please pay careful attention.
(4) It is recommended that solder with a grain diameter of 32
μm or smaller is used
so as to print a constant amount of solder.
