A. Do not attempt to lift the component off the board until the
component is completely disconnected from the board by a
twisting action.
B. Be careful not to break the copper foil on the printed circuit
board.
Fig. 10-1
3. Installing the leadless component
A. Presolder the contact points on the circuit board.
Fig. 10-2
B. Press the part downward with tweezers and solder both
electrodes as shown below.
Fig. 10-3
Note:
Do not glue the replacement leadless component to the circuit
board.
5.1.19. MODEL NO. IDENTIFICATION MARK
Use Marks shown in the chart below to distinguish the different models included in this Service
Manual.
22
Содержание Omnivision PV-C1321
Страница 9: ...Fig 1 4 Fig 1 5 9 ...
Страница 23: ...5 2 IC TRANSISTOR AND CHIP PART INFORMATION 23 ...
Страница 27: ...Fig D4 Fig D5 27 ...
Страница 31: ...6 2 2 Inner Parts Location Fig J1 1 31 ...
Страница 32: ...6 2 3 EJECT Position Confirmation Fig J1 2 32 ...
Страница 33: ...6 2 4 Grounding Plate Unit Full Erase Head and Cylinder Unit Fig J2 1 33 ...
Страница 84: ...84 ...
Страница 88: ...11 2 MECHANISM BOTTOM SECTION 88 ...
Страница 89: ...11 3 CASSETTE UP COMPARTMENT SECTION 89 ...
Страница 90: ...11 4 CHASSIS FRAME SECTION 1 90 ...
Страница 91: ...11 5 CHASSIS FRAME SECTION 2 91 ...
Страница 93: ... Model PV C2011 PV C2021 PV C2031W VV 2001 PV C2061 93 ...
Страница 111: ...R4591 ERDS2TJ681T CARBON 1 4W 680 111 ...
Страница 113: ...R6009 ERJ6GEYJ102V MGF CHIP 1 10W 1K 113 ...
Страница 135: ...R6032 ERJ6GEYJ102V MGF CHIP 1 10W 1K 135 ...
Страница 142: ...C3060 ECEA1CKA100 ELECTROLYTIC 16V 10UF 142 ...