14
3.5.
General Description About Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30
°
C (86
°
F) more than that of the
normal solder.
Distinction of P.C.B. Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the P.C.B. using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the P.C.B. cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
°
C
(662±86
°
F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01KS-----------(0.3mm 100g Reel)
RFKZ06D01KS-----------(0.6mm 100g Reel)
RFKZ10D01KS-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn) 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
Содержание Lumix DMC-GH4H series
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Страница 23: ...23 4 2 Lens...
Страница 25: ...25 5 2 Lens...
Страница 27: ...27 Error Code List The error code consists of 8 bit data and it shows the following information...
Страница 29: ...29 7 Troubleshooting Guide 7 1 Checking Method of Body and Interchangeable Lens...
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Страница 33: ...33...
Страница 38: ...38 7 4 Failure Diagnosis of NFC...
Страница 44: ...44 9 1 2 P C B Location...
Страница 47: ...47 Fig D2 Fig D3 9 1 3 2 Removal of the Main P C B Fig D4...
Страница 49: ...49 Fig D8 9 1 3 5 Removal of the Top Case Unit Fig D9 Fig D10...
Страница 50: ...50 9 1 3 6 Removal of the Battery Case Unit and Capacitor P C B Unit Fig D11 Fig D12...
Страница 51: ...51 9 1 3 7 Removal of the Wi Fi NFC P C B and NFC Unit Fig D13 Fig D14...
Страница 52: ...52 9 1 3 8 Removal of the Tripod and Wi Fi BG FPC Fig D15 Fig D16...
Страница 53: ...53 9 1 3 9 Removal of the Mount Box Unit Fig D17 Fig D18...
Страница 55: ...55 Fig D21 Fig D22...
Страница 56: ...56 9 1 3 12 Removal of the LCD IF P C B Fig D23 Fig D24...
Страница 57: ...57 9 1 3 13 Removal of the LCD Packing Fig D25 9 1 3 14 Removal of the Rear Operation Unit and Speaker Fig D26...
Страница 58: ...58 Fig D27 Fig D28...
Страница 59: ...59 9 1 3 15 Removal of the LCD Lock Holder Unit Fig D29 9 1 3 16 Removal of the SD Door Unit Fig D30...
Страница 61: ...61 Fig D33 9 1 3 19 Removal of the EXT Mic P C B Unit Fig D34...
Страница 62: ...62 9 1 3 20 Removal of the Flash P C B Unit Fig D35 Fig D36...