
8
3.4.
General Description About Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and copper (Cu), and the melting point of the lead free solder is higher approx.30°C (86°F) more than that of the
normal solder.
Distinction of P.C.B. Lead Free Solder being used
Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the P.C.B. using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the P.C.B. cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt the
lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30°C
(662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
SVKZ000001-----------(0.3mm 100g Reel)
SVKZ000002-----------(0.6mm 100g Reel)
SVKZ000003-----------(1.0mm 100g Reel)
Note
* Ingredient: Tin (Sn) 96.5%, Silver (Ag) 3.0%, Copper (Cu) 0.5%. (Flux cored)
Содержание Lumix DC-LX100M2EB
Страница 15: ...15 ...
Страница 26: ...26 9 2 P C B Location ...
Страница 28: ...28 Fig D1 9 3 1 Removal of the Rear Case Unit Fig D2 ...
Страница 29: ...29 Fig D3 Fig D4 ...
Страница 30: ...30 9 3 2 Removal of the LCD Fig D5 Fig D6 ...
Страница 31: ...31 9 3 3 Removal of the LVF Unit Fig D7 9 3 4 Removal of the Main P C B Fig D8 ...
Страница 32: ...32 Fig D9 9 3 5 Removal of the Lens Unit Fig D10 ...
Страница 33: ...33 Fig D11 Fig D11 1 ...
Страница 34: ...34 Fig D12 9 3 6 Removal of the Top Case Unit Fig D13 Fig D14 ...
Страница 35: ...35 9 3 7 Removal of the Battery P C B Fig D15 9 3 8 Removal of the Frame Unit Fig D16 ...
Страница 36: ...36 Fig D17 9 3 9 Removal of the Battery Door Unit Fig D18 9 3 10 Removal of the Battery Case Fig D19 ...
Страница 37: ...37 Fig D20 9 3 11 Removal of the WIFI BT P C B Speaker NFC Plate and NFC Spacer Fig D21 Fig D22 ...
Страница 38: ...38 Fig D23 9 3 12 Removal of the Lens Ring Unit Fig D24 9 3 13 Removal of the Top FPC Unit Fig D25 ...
Страница 49: ...49 9 5 9 Assembly of the Lens FPC Motor Unit ...
Страница 50: ...50 ...
Страница 59: ...59 ...
Страница 60: ...60 ...
Страница 61: ...61 ...
Страница 62: ...62 ...