After removing the Flat IC and when attaching the new IC, remove any of the excess solder on
the land using the soldering wire, etc. If the excess solder is not removed from the land, the IC
will slip and not be attached properly.
11.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporary fix FLAT PACKAGE IC by soldering on two marked
pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using the specified solder, in the direction of the arrow, by
sliding the soldering iron.
11.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly re-solder the bridged portion.
2. Remove the remaining solder along pins using a soldering iron as
shown in the figure below.
Содержание KX-TD7895 - Digital Spread Spedtrum Telephone
Страница 3: ...3 2 CONNECTIONS OF HANDSET ...
Страница 4: ...3 3 BASE UNIT ...
Страница 5: ...4 DISASSEMBLY INSTRUCTIONS 4 1 BASE UNIT ...
Страница 6: ...1 Remove the four screws A and remove the Bottom Cabinet ...
Страница 9: ...2 Take the Battery out of the Rear Cabinet after disconnecting the Connector ...
Страница 10: ...3 Remove two Screws D from the Rear Cabinet ...
Страница 12: ...6 Remove the Antenna from the Front Cabinet after removing the Screw E ...
Страница 13: ...7 Remove the RF unit from the Main Board ...
Страница 20: ...34 CHARGE I ON OFF ...
Страница 23: ...6 4 RF UNIT FREQUENCY TABLE ...
Страница 32: ...10 TROUBLESHOOTING GUIDE 10 1 NO VOICE RECEPTION 10 2 NO VOICE TRANSMISSION ...
Страница 33: ...10 3 NO LINK BASE UNIT ...
Страница 39: ...12 CABINET AND ELECTRICAL PARTS LOCATION 12 1 BASE UNIT ...
Страница 40: ...12 2 HANDSET ...
Страница 41: ...12 3 CHARGER ...
Страница 42: ...13 ACCESSORIES AND PACKING MATERIALS ...
Страница 46: ... CAPACITORS ...
Страница 63: ......
Страница 64: ......