(Original flux should be replaced daily.)
10.2. FLAT PACKAGE IC REMOVE PROCEDURE
1. When all of the IC lead can not been seen at the standard degree,
fill with large quantities of solder.
Note:
If you do not fill with solder and directly cut the IC lead with the cutter, stress may build up
directly in the P.C.board’s pattern. If you do not fill with large quantities of solder as in step 1
the P.C.board pattern may be removed.
2. Using a cutter, cut the lead at the source. (Cut the contents with
the cutter lightly 5 or 6 times.)
3. Remove when the solder melts. (Remove the lead at the same
time.)
34
Содержание KX-T7456 - Digital 24 Button Speakerphone Display
Страница 4: ...4 DISASSEMBLY INSTRUCTIONS 4 1 HOW TO REMOVE THE LOWER CABINET Procedure 1 4 ...
Страница 8: ...5 IC DATA 5 1 IC1 8 ...
Страница 11: ...11 ...
Страница 15: ...15 ...
Страница 20: ...7 4 DATA COMMUNICATION CIRCUIT 1 Function 20 ...
Страница 24: ...The reset signal is negledted 24 ...
Страница 29: ...8 TROUBLESHOOTING GUIDE 8 1 NO OPERATION 8 2 THE LCD DOES NOT OPERATE 29 ...
Страница 31: ...8 5 SPEAKER PHONE TROUBLE 8 6 TONE DIAL TROUBLE 8 7 TROUBLE OF OHCA 31 ...
Страница 32: ...8 8 HANDSET TROUBLE 9 TERMINAL GUIDE OF ICS TRANSISTORS AND DIODES 32 ...
Страница 36: ...12 CABINET AND ELECTRICAL PARTS LOCATION 13 ACCESSORIES AND PACKING MATERIALS 36 ...
Страница 49: ...33 37 34 35 36 25 32 ...
Страница 55: ...SW301 CN301 1 2 3 ...
Страница 57: ...1 5 2 6 3 7 4 8 ...
Страница 58: ...9 13 10 14 11 15 12 16 ...
Страница 59: ...17 21 18 22 19 23 20 24 ...