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1. Temporary fix FLAT PACKAGE IC by soldering on two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using the specified solder, in the direction of the arrow, by
sliding the soldering iron.
10.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly re-solder the bridged portion.
2. Remove the remaining solder along pins using a soldering iron as
shown in the figure below.
11. WAVEFORM
12. CABINET AND ELECTRICAL PARTS LOCATION
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Содержание KX-T7453
Страница 7: ...5 IC DATA 5 1 IC1 7 ...
Страница 10: ...10 ...
Страница 15: ...15 ...
Страница 21: ...The reset signal is negledted 21 ...
Страница 26: ...8 2 THE LCD DOES NOT OPERATE 26 ...
Страница 28: ...8 5 SPEAKER PHONE TROUBLE 8 6 TONE DIAL TROUBLE 8 7 HANDSET TROUBLE 28 ...
Страница 29: ...9 TERMINAL GUIDE OF ICS TRANSISTORS AND DIODES 29 ...
Страница 33: ...13 ACCESSORIES AND PACKING MATERIALS 33 ...
Страница 34: ...14 REPLACEMENT PARTS LIST Note 1 The marking RTL indicates that the Retention Time is limited for this item 34 ...
Страница 39: ... 39 ...
Страница 41: ...41 ...
Страница 43: ...43 ...
Страница 48: ...1 5 2 6 3 7 4 8 ...
Страница 49: ...9 13 10 14 11 15 12 16 ...
Страница 50: ...17 21 18 22 19 23 20 24 ...
Страница 51: ...33 34 35 36 25 32 ...
Страница 57: ...SW301 CN301 1 2 3 ...