Panasonic KX-DT543-B, Руководство по обслуживанию

Страница: 2 / 74

2
KX-DT543/KX-DT543-B/KX-DT546/KX-DT546-B
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions ----------------------------------------------- 3
1.1. For Service Technicians ---------------------------------3
2 Warning -------------------------------------------------------------- 4
2.1. About Lead Free Solder (PbF: Pb free) --------------4
2.1.1. Suggested PbF Solder -------------------------------4
2.2. Discarding of P. C. Board --------------------------------4
3 Specifications ------------------------------------------------------ 5
4 Technical Descriptions ------------------------------------------ 6
4.1. Block Diagram ----------------------------------------------6
4.2. Circuit Operations ------------------------------------------7
4.2.1. LCD Circuit ----------------------------------------------7
4.2.2. Reset Circuit --------------------------------------------7
4.2.3. Data Communication ---------------------------------8
4.2.4. DXDP Communication -------------------------------9
4.2.5. Analog Circuit ---------------------------------------- 10
4.2.6. ASIC (IC300) ----------------------------------------- 11
4.2.7. ASIC (IC150) ----------------------------------------- 12
4.2.8. Key Circuit--------------------------------------------- 13
4.2.9. LED Circuit -------------------------------------------- 14
4.2.10. EHS Circuit-------------------------------------------- 15
4.2.11. Power Supply Circuit ------------------------------- 16
5 Location of Controls and Components ------------------ 17
5.1. Name and Locations ------------------------------------ 17
6 Installation Instructions --------------------------------------- 18
6.1. Connections ----------------------------------------------- 18
7 Test Mode ---------------------------------------------------------- 19
7.1. Function Test Mode-------------------------------------- 19
7.1.1. Preparation-------------------------------------------- 19
7.1.2. KEYs and LEDs Test ------------------------------- 19
8 Troubleshooting Guide ---------------------------------------- 20
8.1. No Operation ---------------------------------------------- 20
8.2. ASIC1(IC300) Does Not Operate -------------------- 26
8.3. LCD Does Not Operate --------------------------------- 27
8.4. DXDP Does Not Work ---------------------------------- 28
8.5. Audio Problem -------------------------------------------- 29
8.6. Handset Does Not Work-------------------------------- 29
8.6.1. Receive ------------------------------------------------ 29
8.6.2. Send ---------------------------------------------------- 30
8.7. Headset Does Not Work-------------------------------- 31
8.7.1. Receive ------------------------------------------------ 31
8.7.2. Send ---------------------------------------------------- 32
8.8. Speaker-Phone/Ringer Does Not Work ------------ 33
8.8.1. Receive / Ringer ------------------------------------- 33
8.8.2. Send ---------------------------------------------------- 33
8.9. LED Does Not Light ------------------------------------- 34
8.10. EHS Does Not Work------------------------------------- 35
8.10.1. EHS (Plantronics) Does Not Work ------------- 35
8.10.2. EHS (Jabra) Does Not Work --------------------- 36
9 Disassembly and Assembly Instructions --------------- 37
9.1. Remove Main Board and Ope Board --------------- 37
9.2. Remove and Assembly for LCD -------------------- 38
9.3. Assembly for Lead wire--------------------------------- 39
10 Miscellaneous ---------------------------------------------------- 41
10.1. Terminal Guide of the ICs Transistors and
Diodes------------------------------------------------------- 41
10.1.1. Main Board-------------------------------------------- 41
10.1.2. Operation Board ------------------------------------- 41
10.2. How To Replace a Flat Package IC ----------------- 42
10.2.1. Preparation ------------------------------------------- 42
10.2.2. Removal Procedure -------------------------------- 42
10.2.3. Procedure--------------------------------------------- 42
10.2.4. Removing Solder From Between Pins--------- 42
10.2.5. Memo -------------------------------------------------- 43
11 Schematic Diagram -------------------------------------------- 44
11.1. Main No.1-------------------------------------------------- 44
11.2. Main No.2-------------------------------------------------- 46
11.3. Ope---------------------------------------------------------- 48
11.4. Waveform -------------------------------------------------- 50
11.4.1. No.(1)-(6)---------------------------------------------- 50
11.4.2. No.(7)-(10) ------------------------------------------- 51
11.4.3. No.(11)-(12)------------------------------------------- 52
11.4.4. No.(13)-(15) ------------------------------------------ 53
11.4.5. No.(16)-(17) ------------------------------------------ 54
11.4.6. No.(18)-(21) ------------------------------------------ 55
11.4.7. Memo -------------------------------------------------- 56
12 Printed Circuit Board ------------------------------------------ 57
12.1. Main Board ------------------------------------------------ 57
12.1.1. Component View ------------------------------------ 57
12.1.2. Bottom View ------------------------------------------ 58
12.2. Operation Board ----------------------------------------- 59
12.2.1. Component View ------------------------------------ 59
12.2.2. MIC Board Component View--------------------- 60
13 Appendix Information of Schematic Diagram -------- 61
14 Exploded View and Replacement Parts List ----------- 62
14.1. IC Data ----------------------------------------------------- 62
14.1.1. IC410--------------------------------------------------- 62
14.1.2. IC300--------------------------------------------------- 65
14.1.3. IC150--------------------------------------------------- 66
14.2. Cabinet and Electric Parts----------------------------- 67
14.3. Accessories and Packing Materials ----------------- 68
14.4. Replacement Parts List -------------------------------- 69
14.4.1. Cabinet and Electrical Parts---------------------- 69
14.4.2. Accessories and Packing Materials ------------ 70
14.4.3. Main Board Parts ----------------------------------- 70
14.4.4. Ope Board Parts ------------------------------------ 72