8
3.4.
Baking of replacement IC and defective P.C.B.
When replacing the CSP/BGA/QFN type IC mounted on the P.C.B., the problem of IC crack or foil pattern breaking in the P.C.B.
might sometimes occur by rapid heating.
In order to improve the success rate of IC replacement for repair, it would be required to work out baking of replacement
IC and defective P.C.B. before replacing IC.
Please refer the way of baking as follows.
Replacement IC and defective P.C.B. must be put in the heater together.
• Baking temperature and time (Hour)
80°C / 24 hour
Содержание HC-V380PP
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Страница 24: ...24 8 2 PCB Location ...
Страница 27: ...27 8 3 1 Removal of the Side Case L Unit Fig D1 Fig D2 ...
Страница 31: ...31 Fig D12 Fig D13 ...
Страница 33: ...33 Fig D17 Fig D18 ...
Страница 34: ...34 8 3 10 Removal of the LCD Hinge Unit Fig D19 Fig D20 ...
Страница 35: ...35 8 3 11 Removal of the Monitor P C B LCD Fig D21 Fig D22 ...
Страница 36: ...36 Fig D23 8 3 12 Removal of the Spring Holder Bar rier Lever Front Base Barrier R Barrier F Fig D24 ...
Страница 38: ...38 8 3 14 Removal of the MOS Unit IR Cut Glass Fig D27 Fig D28 ...
Страница 39: ...39 Fig D29 8 3 15 Removal of the 2nd Stepping Motor Fig D30 ...
Страница 40: ...40 Fig D31 8 3 16 Removal of the 3rd Stepping Motor Fig D32 ...
Страница 41: ...41 Fig D33 8 3 17 Removal of the Focus Stepping Motor Fig D34 ...
Страница 42: ...42 Fig D35 ...
Страница 45: ...45 Level Shot Adjutment Chart ...
Страница 47: ...47 9 1 2 Adjustment Items Adjustment item as follows ...
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