10
3.6.
Baking of replacement IC and defective P.C.B.
When replacing the CSP/BGA/QFN type IC mounted on the P.C.B., the problem of IC crack or foil pattern breaking in the P.C.B.
might sometimes occur by rapid heating.
In order to improve the success rate of IC replacement for repair, it would be required to work out baking of replacement
IC and defective P.C.B. before replacing IC.
Please refer the way of baking as follows.
Replacement IC and defective P.C.B. must be put in the heater together.
• Baking temperature and time (Hour)
80
°
C / 24 hour
Содержание HC-V201P
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Страница 36: ...36 8 3 1 Removal of the Side Case L Unit Fig D1 Fig D2 ...
Страница 37: ...37 8 3 2 Removal of the Top Case Fig D3 8 3 3 Removal of the Barrier Front Unit Fig D4 ...
Страница 38: ...38 Fig D5 8 3 4 Removal of the Lens Unit Fig D6 Fig D7 8 3 5 Removal of the SD Holder P C B Main P C B Fig D8 ...
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Страница 42: ...42 8 3 8 Removal of the MOS Unit IR Cut Glass Fig D16 Fig D17 ...
Страница 43: ...43 Fig D18 8 3 9 Removal of the 2nd Stepping Motor Focus Stepping Motor Fig D19 ...
Страница 44: ...44 Fig D20 8 3 10 Removal of the Barrier Unit Fig D21 ...
Страница 46: ...46 8 3 12 Removal of the Rear Cover Unit Top Operation BATT Catcher P C B Fig D24 Fig D25 ...
Страница 49: ...49 9 1 2 Adjustment Items Adjustment item as follows ...
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