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2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive
(ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ES device).
4
DMR-EH57GN
Содержание DMR-EH57GN
Страница 5: ...2 2 Precaution of Laser Diode 5 DMR EH57GN ...
Страница 7: ...3 Service Navigation 3 1 Service Information 3 2 Caution for DivX 7 DMR EH57GN ...
Страница 8: ...4 Specifications 8 DMR EH57GN ...
Страница 9: ...9 DMR EH57GN ...
Страница 10: ...5 Location of Controls and Components 10 DMR EH57GN ...
Страница 11: ...11 DMR EH57GN ...
Страница 13: ...6 1 2 When the Forcible Disc Eject can not be done 13 DMR EH57GN ...
Страница 29: ...9 2 P C B Positions 29 DMR EH57GN ...
Страница 38: ...10 1 2 Checking and Repairing of RAM Digital P C B Module 38 DMR EH57GN ...
Страница 39: ...10 1 3 Checking and Repairing of Main P C B 39 DMR EH57GN ...
Страница 40: ...10 1 4 Checking and Repairing of HDD 40 DMR EH57GN ...
Страница 41: ...10 2 Caution for Replacing Parts 10 2 1 Items that should be done after replacing parts 41 DMR EH57GN ...
Страница 44: ...44 DMR EH57GN ...
Страница 70: ...DMR EH57GN 70 ...
Страница 79: ...13 5 ATAPI P C B ATAPI P C B DMR EH57GN ATAPI P C B VEP70194A 1 A B 2 3 4 5 DMR EH57GN 79 ...
Страница 80: ...DMR EH57GN 80 ...
Страница 88: ...15 Parts and Exploded Views 15 1 Exploded Views 15 1 1 Casing Parts Mechanism Section 88 DMR EH57GN ...
Страница 89: ...15 1 2 Packing Accessories Section 89 DMR EH57GN ...
Страница 100: ...3 DMR EH57GC DMR EH57GCS DMR EH57GN ...
Страница 101: ...2 Changes of Exploded Views 2 1 Changes of Casing Parts Mechanism Section 4 DMR EH57GC DMR EH57GCS DMR EH57GN ...
Страница 102: ...2 2 Changes of Packing Accessories Section 5 DMR EH57GC DMR EH57GCS DMR EH57GN ...