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6. The potential at any point should not exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) may be
used to make the hot checks, leakage current must not exceed 1/2
milliampere. In case a measurement isoutside of the limits
specified, there is a possibility of a shock hazard, and the
equipment should be repaired and rechecked before it is returned
to the customer.
2. Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatic Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistor-sandsemiconductor "chip"
components. The following techniques should be used to help reduce the incidence of
component damage caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and
wear a commercially available discharging ESD wrist strap,
whichshould be removed for potential shock reasons prior to
applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as aluminum
foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device. Some solder
removal devices not classified as "anti-static (ESD protected)"
can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together by conductive foam, aluminum foil or
4
Содержание DMR-E85HEP
Страница 1: ...ORDER NO DSD0405014C8 DVD Video Recorder DMR E85HEP Colour S Silver Type SPECIFICATIONS 1 ...
Страница 35: ...11 2 Checking and Repairing of Main P C B 35 ...
Страница 36: ...11 3 Checking and Repairing of Digital P C B 36 ...
Страница 37: ...11 4 Checking and Repairing of DVD RAM Drive 37 ...
Страница 38: ...11 5 Checking and Repairing of HDD 38 ...
Страница 50: ...19 2 Casing Parts Mechanism Section 2 50 ...
Страница 51: ...19 3 Packing Accessories Section 51 ...
Страница 64: ...C0705 ECJ1VB1E104K 25V 0 1U 1 64 ...
Страница 76: ...L109 LHLZ4R7M COIL 1 76 ...
Страница 80: ...1 A B C D 2 3 4 5 Nicam Decoder P C B DMR E85HEP Nicam Decoder P C B VEP07A51A ...
Страница 84: ...1 A B C D E F 2 3 4 5 6 7 Digital P C B Foil Side OVER VIEW DMR E85HEP Digital P C B Foil Side RFKBE85HEP ...
Страница 89: ...1 A B C D 2 3 4 5 6 7 8 9 Front R P C B DMR E85HEP Front R P C B REP3713B ...
Страница 91: ...Ref No MODE E C B REC 0 3 5 0 PLAY 0 3 5 0 STOP 0 3 5 0 QR7801 ...
Страница 96: ...1 A B C 2 3 4 Location Map REAR DMR E85HEP Main P C B REP3766C 1 4 Section FRONT 1 4 2 4 3 4 4 4 ...
Страница 97: ...5 6 7 8 Location Map REAR DMR E85HEP Main P C B REP3766C 2 4 Section FRONT 1 4 2 4 3 4 4 4 ...
Страница 98: ...Main P C B D E F Location Map REAR DMR E85HEP Main P C B REP3766C 3 4 Section FRONT 1 4 2 4 3 4 4 4 ...
Страница 99: ...Location Map REAR DMR E85HEP Main P C B REP3766C 4 4 Section FRONT 1 4 2 4 3 4 4 4 ...
Страница 120: ...1 A B C D E 2 3 4 5 VIF Decoder P C B DMR E85HEP VIF Decoder P C B VEP07A71N ...
Страница 174: ...72 ...
Страница 175: ...72 ...
Страница 178: ......