Panasonic AG-DV2500E, Руководство по обслуживанию

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Typically the melting point is 50-70°F (30-40°C) higher. Please use
a high temperature soldering iron. In case of the soldering iron
with temperature control, please set it to 700±20°F (370±10°C ).
2. Pb free solder will tend to splash when heated too high (about
1100°F /600°C ).
ELECTROSTATICALLY SENSITIVE (ES) DEVICES
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically sensitive (ED) Devices. Examples of typical
ES devices are integrated circuits and some field-effect transistors and semiconductor “chip”
components. The following techniques should be used to help reduce the incidence of
component damage caused by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. /
Alternatively, obtain and wear a commercially available
discharging wrist trap device, which should be removed for
potential shock reasons prior to applying power to the unit under
test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as aluminum
foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device classified as “anti-
static” can generate electrical charges sufficient to damage ES
devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. / (most
replacement ES devices are package with leads electrically
shorted together by conductive foam, aluminum foil or comparable
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