Solder down the tab on the top left of the package to ensure it is firmly held in place. Apply flux to
the data pins at the base of the package and then apply the soldering iron and a small amount of
solder to each pin one at a time. Ensure there are no shorts between pins, or between any of the
pins and the metal body of the SD card socket. Use extra flux and solder wick to remove any excess
solder from any bridged pins.
Solder the remaining pins on the right hand side of the package and then, while wearing gloves,
repeat the cleaning process described in step 1.
